The Stacked CSP (S-CSP) family utilizes Amkor's industry leading ChipArray® Ball Grid Array (CABGA) manufacturing capabilities. This broad high volume infrastructure enables the rapid deployment of advances in die stacking technology across multiple products and factories to achieve lowest total cost requirements.

Stacked CSP technology enables the stacking of a wide range of different semiconductor devices to deliver the high level of silicon integration and area efficiency required in portable multi-media products. Stacked CSP uses high density thin core substrates, advanced wafer thinning, die attach, flip chip and wire bonding capabilities to stack multiple devices in a conventional fine pitch BGA (FBGA) surface mount component. These advanced assembly capabilities in combination with Amkor's expertise in design and test, enable stacks up to 9 active devices without sacrificing yield or mounted height requirements.

Many customers have relied on Amkor to solve their highest density and most complex device stack combinations. As a result, Amkor has established industry leadership in stacking complex mixed signal, logic + memory devices, including digital base band or applications processors + high density flash or mobile DRAM devices. Designers are looking to Stacked CSP technologies to achieve integration, size and cost reductions in future chip set combinations.

For more information on our Stacked CSP package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request Form.