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Shrink Small Outline Package (SSOP / SOP)
 How do you reduce an SOP size and its board footprint demand? Amkor did it by taking a family of SOPs and shrinking them. The body size was compressed and the lead pitch tightened to obtain a smaller version SOP. This yields an IC package which is a significant reduction in the size (compared to standard package). All IC assembly processes remain the same as with our standard SOPs. The use of proven, reliable materials coupled with statistically controlled processes, assures long term, worry-free operation of your IC chips.
Applications:
These packages enable end-products (pagers, portable audio/video, disc drives, radio, RF devices/components, telecom) to be reduced in size and weight. Semiconductor families such as operational amplifiers, drivers, optoelectronics, controllers, logic, analog, memory, comparators and more using BiCMOS, CMOS or other silicon / GaAs technologies are well addressed by Amkor’s SSOP product family.
Features:
Amkor’s SSOP package portfolio provides:
- 14 to 56 lead counts
- 150, 209 and 300 mil body sizes
- JEDEC and EIAJ package outline standard compliance
- High-conductivity copper leadframes
- Wide selection of die pad sizes
- Broad open-tooled portfolio
- Solder plate lead finish (Pb-Sn, Sn-Bi, Matte Sn available)
- Strip Test with New Matrix Leadframe
Mechanical Samples:
For mechanical samples of our SSOP package, please click here.
Thermal Resistance:
Multi-Layer PCB, JEDEC Standard Test Boards
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Theta JA (°C/W) by Velocity |
| Pkg |
Body Size (mm) |
Pad Size (mm) |
0 |
200 |
500 |
| 20 ld |
3.9 x 8.7 |
2.4 x 3.6 |
80.8 |
73.2 |
69.2 |
| 28 ld |
5.3 x 10.2 |
3.84 x 8.10 |
49.0 |
36.0 |
30.0 |
Electrical:
Simulated Results @ 100 MHz
| Pkg |
Body Size (mm) |
Pad Size (mm) |
Lead |
Inductance (nH) |
Capacitance (pF) |
Resistance (m ) |
| 20 ld |
5.3 x 7.2 |
3.9 x 5.4 |
Longest |
2.260 |
0.395 |
19.0 |
| 20 ld |
5.3 x 7.2 |
3.9 x 5.4 |
Shortest |
0.958 |
0.209 |
9.1 |
| 28 ld |
3.9 x 9.9 |
2.4 x 4.8 |
Longest |
1.590 |
0.376 |
14.1 |
| 28 ld |
3.9 x 9.9 |
2.4 x 4.8 |
Shortest |
0.757 |
0.198 |
7.53 |
| 28 ld |
5.3 x 10.2 |
3.9 x 5.1 |
Longest |
2.510 |
0.463 |
21.5 |
| 28 ld |
5.3 x 10.2 |
3.9 x 5.1 |
Shortest |
0.928 |
0.206 |
9.57 |
| 56 ld |
7.5 x 18.4 |
2.5 x 5.6 |
Longest |
6.410 |
0.941 |
47.4 |
| 56 ld |
7.5 x 18.4 |
2.5 x 5.6 |
Shortest |
2.490 |
0.497 |
23.1 |
Reliability:
Package reliability is assured for worry-free operation
| HAST: |
130 °C / 85% RH, no bias, 96 hours |
| High Temp Storage: |
150°C, 1000 hours |
| Temp Cycle: |
-65 / +150°C, 500 cycles |
Process Highlights:
| Die thickness: |
3.9 mm (150 mil) 16 mil
5.3 mm (209 mil) 17 mil
7.5 mm (300 mil) 25 mil |
| Bond pad pitch: |
90 micron |
| Strip solder plating: |
85/15 Sn/Pb |
| Marking: |
Laser / pad ink |
| Lead inspection: |
Optical |
| Pack / ship options: |
Bar code, tube / box, TNR |
| Coplanarity (max): |
0.003 inch (0.08 mm) |
Standard Material:
| Leadframe Alloy: |
C194 |
| Die Attach Material: |
84-1 LMISR4 |
| Gold Wire: |
0.8 - 1.2 mil diameter |
| Mold Compound: |
Nitto MP8000AN |
| Lead Finish: |
85 / 15 Solder (Sn / Pb) |
Standard Pb-Free / Green Material:
| Leadframe Alloy: |
C194 |
| Die Attach Material: |
84-1 LMISR4 |
| Gold Wire: |
0.8 - 1.2 mil diameter |
| Mold Compound: |
Sumitomo G600 |
| Lead Finish: |
100% Sn or NiPdAu PPF |
Test Services:
Contact Amkor Test Services for more details.
- Program generation / conversion
- Product engineering support
- Wafer sort
- Burn-in
- Tape and reel services
- Ambient to +165 °C test available
Shipping:
- Clear antistatic tube (20 inch)
Additional Information:
| Description |
File Type |
File Size |
| SSOP / SOP Data Sheet |
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106 kb
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For more information on the SSOP / SOP package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form. |
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