Amkor Technology is committed to continuing to service this long established standard industry package. The Side Braze package comes in a wide range of lead counts: from 8-48 leads with a lead pitch of 100 mil inches. This thru-hole package consists of a co-fired ceramic base that has leads brazed on two parallel edges of the package. The dual-in-line configuration of the leads makes this package "footprint" compatible to the CerDIP or PDIP packages. The lid for this package can be either ceramic "frit sealed" or metal "solder sealed". This package provides a hermetic environment for the IC inside.

Applications:

Along with the other standard industry packages, the Side Braze package has a proven track record and is still being used by semiconductor technologies such as: logic, memory, microcontrollers and video controllers. Some end applications are: consumer electronics, commercial electronics, military electronics, automotive and telecommunications.

Features:

The Side Braze package offers a variety of features:

• 300, 400, 600 mil package body widths
• 8 to 64 lead count, 100 mil inch lead pitch
• Gold pre-plated lead finish
• Wide selection of cavity sizes to meet most die size needs
• Hermetic packager
• High thermal conductive ceramic
• Commercial or full Military flows