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SuperBGA® (SBGA)
 The SuperBGA (SBGA) technology provides a very low profile, high-power BGA package. The IC is directly attached to an integrated copper heatsink. Since the IC and I/O are on the same side, signal vias are eliminated, providing a significant improvement in electrical performance (inductance). SBGAs are available in a broad line of ball (I/O) counts and standard JEDEC body sizes which are supported by an industry infrastructure (sockets, trays, etc). SuperBGA's utilize advanced substrate designs with proven assembly practices and materials to assure your IC complementary performance. Amkor's Tape-SuperBGA technology combines SBGA thermal performance with the benefits of one metal layer flexible circuit tape. Like the SBGA package, Tape-SuperBGA offers a high-power solution for design engineers with the additional benefits of low profile and cost effectiveness in a cavity down package.
Applications:
This technology is especially applicable for your high-speed, high-power semiconductors, such as ASICs, Micro processors, Gate Arrays and DSPs requiring high-performance packages. SBGA technology fills the demand for speed, power and space requirements of wireless telecommunications, cellular, laptops, palmtops, notebook / sub-notebooks, PDAs, wireless, video GUI and VME CPU / BUS boards and other advanced end applications. Features:
Exceptional performance by innovative design provides the following
- 80 - 1036 ball count
- 13 - 45 mm body size
- Superior thermal performance
- 2-Layer + Cu Stiffener + Cu Heat Spreader
- Many Open Tool Designs Available
- Low profile (1.7 mm mounted)
- Light weight
- Moisture resistant (JEDEC Level 3)
- Enhanced electrical performance > 1 Ghz
- Quickest design-to-prototype delivery
- Excellent reliability
- JEDEC MO-192 standard outlines
- Mature supply base
- Standard Laminate design rules
Mechanical Samples:
For mechanical samples of our SuperBGA® package, please click here.
Electrical:
| (Typical) 35 x 35 mm Body |
Min. |
Max. |
| Self capacitance (pF) |
1.1 |
1.4 |
| Trace self inductance (nH) |
0.75 |
7.3 |
Resistance (m ) |
120.8 |
467.8 |
| Characteristic impedance () |
50 |
75 |
Thermal Resistance:
Multi-Layer PCB
| Package |
Body Size (mm) |
Theta JA (°C/W) |
| 256 |
27 x 27 |
14.1 |
| 304 |
31 x 31 |
13.1 |
| 352 |
35 x 35 |
11.7 |
| 432 |
40 x 40 |
10.2 |
| 600 |
45 x 45 |
8.3 |
Reliability:
Reliability is of prime importance and is assured by optimization of design, process and materials. Your semiconductor chips are mounted in a low stress package providing long term, worry-free operation.
| Autoclave: |
121 °C, 15 PSI, 168 hours |
| Temp Cycle: |
-55/+125 °C, 1000 cycles |
| Temp / Humidity: |
85 °C/85% RH, 1000 hours |
| High temp storage: |
150 °C, 1000 hours |
Process Highlights:
| Die thickness (typical): |
0.30 mm |
| Bond pad pitch (min): |
0.065 mm |
| Topside marking: |
Pad or Laser |
| Wafer backgrinding: |
Available |
| Pack/ship options: |
Dry pack |
Standard Materials:
| Package Substrate |
|
| - Conductor: |
ED Copper |
| - Dielectric: |
ED Copper |
| - Heatsink: |
Alloy 194 Copper |
| Die attach: |
Silver filled adhesive |
| Encapsulant: |
Black epoxy |
| Solder ball: |
Eutectic SnPb |
| Gold wire: |
0.025 - 0.030 mm dia. |
| Marking: |
Ink |
Shipping:
- Low profile tray (JEDEC Outline CO-029)
SuperBGA® Package Offerings:
Body Size |
Max Mounted
Package Height |
Ball
Pitch |
Ball
Matrix |
Ball
Footprint |
3 ROWS |
4 ROWS |
5 ROWS |
23.0 x 23.0 |
1.7 |
1.27 |
17 x 17 |
20.32 |
168 |
- |
- |
27.0 x 27.0 |
1.7 |
1.27 |
20 x 20 |
24.13 |
204 |
256 |
- / - |
31.0 x 31.0 |
1.7 |
1.27 |
23 x 23 |
27.94 |
240 |
304 |
- / - |
35.0 x 35.0 |
1.7 |
1.27 |
26 x 26 |
31.75 |
276 |
352 |
- / - |
37.5 x 37.5 |
1.7 |
1.27 |
29 x 29 |
35.56 |
312 |
400 |
480 |
40.0 x 40.0 |
1.7 |
1.27 |
31 x 31 |
38.10 |
336 |
432 |
520 |
42.5 x 42.5 |
1.7 |
1.27 |
33 x 33 |
40.64 |
360 |
464 |
560 |
45.0 x 45.0 |
1.7 |
1.27 |
35 x 35 |
43.18 |
384 |
496 |
600 |
Additional Information:
| Description |
File Type |
File Size |
| SuperBGA® Data Sheet |
|
322 kb
|
For more information on the SuperBGA® package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form. |
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