Amkor's PBGAs incorporate the most advanced assembly processes and designs for today's and tomorrow's cost/performance applications. This advanced IC package technology allows application and design engineers to optimize innovations while maximizing the performance characteristics of semiconductors. Amkor's PBGAs are designed for low inductance, improved thermal operations and enhanced SMT ability. Custom performance enhancements, like ground and power planes, are available for significant improvements in electrical response demanded by advancing electronics. Additionally, these PBGAs utilize industry proven, semiconductor grade materials for reliable, long-term operations while providing the user flexible design parameters.

Applications:

Semiconductor technologies find enhanced performance by using the integrated design features of Amkor’s PBGAs. Microprocessors / controllers, ASICs, Gate Arrays, memory, DSPs, PLDs, graphics and PC chip sets find Amkor’s PBGA family to be an ideal package. Applications requiring improved portability, form-factor/size and high-performance such as cellular, wireless telecommunications, PCMCIA cards, global positioning systems (GPS), laptop PC’s, video cameras, disc drives, PLDs, graphics and other similar products benefit from Amkor’s PBGA attributes.

Features:

Innovative designs and expanding package offerings provide a platform from prototype-to-production.

• Custom ball counts up to 1521
• 1.00, 1.27 & 1.50 mm ball pitch available
• 13 mm to 40 mm body sizes
• Low Profile and lightweight
• Thermal and electrical enhancement capable
• Highly flexible internal routing of signal, power and ground for device performance and system compatibility
• HDI designs possible
• Suitable substrate for multi-die and integrated SMT structures
• Mature strip based manufacturing process with high yields
• Full in-house design capability
• Quickest design-to-prototype delivery
• Perimeter, stagger and full ball arrays
• Special packaging for memory available
• Multi-layer, ground / power
• JEDEC MS-034 standard outlines
• Excellent reliability
• 63 Sn / 37 Pb Eutectic solder balls

Mechanical Samples:

For mechanical samples of our PBGA package, please click here.

Thermal Resistance:

Multi layer PCB, 0 air flow

* TEPBGA ** TEPBGA-2
Results dependent on body size, die size and PCB design.

Reliability:

Amkor assures you reliable performance by continuously monitoring key indices:

Process Highlights:

Standard Materials:

Test Services:

Shipping:

Cross Section Drawing :

For the PBGA and TEPBGA Standard Package Offerings, please download the PBGA data sheet below.

Additional Information:

Description	File Type	File Size
PBGA Data Sheet		295 kb
MCM-PBGA Data Sheet		125 kb

For more information on the PBGA package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form.