Amkor’s FusionQuad^® represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF^® technologies. The novel integration of bottom lands in a QFP provides a cost-effective platform for increased lead count in a small form factor. FusionQuad^® not only extends the I/O range of classic leadframe packaging to nearly 400 unique pins, it also delivers an approximate 50% reduction in package size for a given leadcount. Additionally, FusionQuad^® provides excellent RF electrical performance characteristics with short signal paths to the bottom lands and high power dissipation capability with the solderable exposed die attach paddle.

System architects, IC designers and packaging engineers will find that FusionQuad^® offers a unique blend of excellent electrical and thermal performance in a miniaturized cost-effective leadframe plastic package. Applications requiring increased data rates or RF communications will benefit from the low insertion loss up to 10 Gigahertz when utilizing the bottom lands for high speed signals. The FusionQuad^® structure also allows the design of multiple segmented power and ground rings typically found in many laminate packages today. Along with the thermal performance advantage of the ExposedPad TQFP, FusionQuad^® brings a new lower cost option to applications normally designed into thermally enhanced laminate packages.

For more information on the FusionQuad^® packages, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form.

The 0.8mm package thickness allows FusionQuad^® to be applied to end products requiring thin profiles such as mobile hard disk drives, notebook computers and other consumer electronics. The unique footprint of FusionQuad^® allows for the use of low cost printed circuit boards in the end application due to the space available for coarse routing vias between the bottom lands and the outer peripheral leads.