Amkor Technology is now offering the Flip Chip CSP (fcCSP) package -- a flip chip solution in a CSP package format. This package construction utilizes eutectic tin / lead (63Sn / 37Pb) flip chip interconnect technology, in either area array or peripheral bump layout, replacing standard wire-bond interconnect. The advantages of flip chip interconnect are twofold: it provides enhanced electrical performance over standard wirebond technology, and it allows for a smaller form factor due to increased routing density, the ability to use area array die bumps and the elimination of wire-bond loops. Current wafer bump technology and flip chip assembly process allows for a minimum of 150 µm peripheral flip chip bumping, or 250 µm area array bumping.

The fcCSP is based on Amkor's proprietary ChipArray^® BGA (CABGA) package construction, using cutting edge thin core laminate substrates. The package is assembled in strip format, gang molded and saw singulated for manufacturing efficiency and cost minimization. Laser ablated solder mask technology, via-in-pad substrate structure, and thin core substrate panel processing allow for increased routing density and enhanced electrical performance, making the fcCSP an attractive option for advanced CSP applications where electrical performance is a critical factor.

The fcCSP is available in both thin core laminate substrate technology, as well as ceramic substrate technology. Package size ranges from 3 mm to 15 mm, accommodating BGA ball pitches from 0.5 mm to 1.0 mm. In addition to BGA technology, the fcCSP is also available in LGA format, allowing for a lower minimum package thickness.

The Ceramic flip chip package provides maximum flexibility for designers for number of layers and routing. Current production is from 300 - 1800 I/O in LGA, BGA or SCI (solder column interposer) formats, 1.27 mm and 1.0 mm pitch. AlSiC lids can be attached for maximum thermal dissipation.

fcBGA (Flip Chip BGA): Moderate routing density, lowest cost flip chip package in intermediate ball counts. Bare die or Single Piece Lid. Qualified with both BU and 4L thin core substrates. Ball Count range is 256 - 1900 and Body Size range is 17 - 45 mm.

Ceramic fcBGA (Ceramic Flip Chip BGA): Alumina or HiTCE flip chip packages with BGA, LGA, or SCI interconnect format. Capability for high layer count enables most flexible format for different ground and power planes. Available in bare die, AISiC Lid, or low cost Flat Lid. Qualified in body sizes ti 45 mm HiTCE (BGA), 45 mm alumina (SCI) and 31 mm alumina (BGA).

Applications:

The fcCSP package is targeted to high-performace workstations, servers, data communication products, internet routers and at high frequency and RF packaging applications where electrical performance is critical. The elimination of wirebond loops allows for a low inductance connection to the die, while the increased routing density enables optimized electrical paths for critical high frequency signal lines. The fcCSP is also an attractive option for portable and handheld electronics where, in addition to performance, package size is critical.

Features:

• Designed for high frequency applications
• 49 - 1800 Ball Counts
• Target Market - Cell Phones, Handheld Electronics
• Array strip production, overmold + singulate
• Combine with multipile die and or passives
• Thin core laminate or ceramic package construction
• Overmolded for handling and second level reliability
• Accommodates package sizes from 3 mm to 15 mm
• Flip Chip bump pitches of 150 µm min. for peripheral array, 250 µm min. for area array
• Available in 0.5 mm - 1.0 mm BGA ball pitch, as well as LGA interconnect
• Minimum package thickness of 0.80 mm for LGA interconnect, 1.0 mm for 0.5 mm BGA pitch, 1.2 mm for 0.8 mm pitch
• Turnkey Solution - Design, bumping, bumped wafer probe, backgrind, assembly, test
• Much better signal to noise ratio at higher frequencies (>1GHz)
• Low inductance of flip chip bumps - short, direct signal path
• Flexible customized substrate routing

Thermal Performance:

Electrical:

8 x 8 mm body, 64 ld, 0.8 mm ball pitch

Simulated results @ at 100 MHz

	Min.	Max.
Inductance	0.26 nH	2.16 nH
Capacitance	0.18 pF	0.38 pF
Resistance	7 m	53.9 m

Reliability:

Board Level:

Process Highlights:

Standard Materials:

Test Services:

Shipping:

Additional Information:

Description	File Type	File Size
fcCSP Data Sheet		120 kb
Flip Chip Packaging Technology Solution   Sheet		318 kb
Flip Chip Packaging of Low-K Devices		58 kb

For more information on the fcCSP package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form.