Amkor's etCSP^® package is the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height. This package can squeeze into applications requiring a thin form factor. The etCSP^® package is constructed using conventional IC processing including standard wire bonding, molding and substrate infrastructure. The resulting package consists of one or two peripheral rows of 0.3 mm diameter solder balls to allow common SMT processing.

There are many advantages as a direct result of the unique etCSP^® design. One key advantage is the 0.5 mm mounted height of the package, the result of solder ball diameter and thin core laminate substrate. Every other aspect of the package, die, wires and moldcap are within the dimensions of the substrate and solderballs. Another direct result of the etCSP^® design is the superior moisture resistance. Since die attach materials are not used to mount the die, there is reduced capability to trap moisture. Therefore, popcorn induced delamination is reduced.

The etCSP^® package can also be designed with the capability of stacking completely tested packages, i.e., packaged memory, into a single footprint on the motherboard. In this manner, two stacked etCSP^® packages can be tested before mounting and the combined height is less than 1.0 mm.

Applications:

Amkor's etCSP^® design makes this package type ideal for PCMCIA card applications, mini disk drives, thin wireless handsets, Flash or EEPROM memory, memory cards, I/O cards, cell phones (memory stacked on logic), digital camcorder / cameras specialty applications (doubling of density) and other portable products where vertical height is limited. Because of the unique design of the etCSP^® package, stacking is easily achieved with proper substrate designs. This creates an opportunity to multiply memory capacity without increasing board area.

Features:

• Up to 336 Ball count
• 7 mm - 13 mm Body size
• Thinnest (JEDEC) XF-XBGA BGA / CSP available at 0.5 mm maximum mounted height
• Sn-Ag (4%) - Cu (0.5%) solder for lead free option
• Conventional process flow with proven wirebond technology
• JEDEC Level 1 Reliability to 260°C reflow temperature
• Package stacking potential of tested packages and two stacked die potential
• Standardized footprints at 0.5 mm pitch
• Fits SMT assembly lines
• Compatible with existing SMD process
• Good board level reliability w/o underfill
• Testing possible prior to stack 1.2 mm height by 2 package stack
• Technology extension for System in Package (SiP) application

Mechanical Samples:

For mechanical samples of our etCSP^® package, please click here.

Thermal Performance:

Amkor’s initial etCSP^® packages are offered for low power applications. Higher thermal performance can be achieved by adding a heat spreader or heat sink to the die's exposed backside. In addition, future die-up configurations will provide a direct heat dissipation path into the product motherboard through the die backside.

Electrical Performance:

	Min	Max
Inductance (nH)	0.735	1.546
Capacitance (pF)	0.176	0.319
Resistance (mOhms)	47.9	89.83

Package Dimensions:

7 x 7 mm body; 89 I/O; 0.3 mm ball diameter; 100 MHz

Reliability:

Package Level*:

Moisture sensitivity:	JEDEC Level 1 @ 260°C
Temp / Humidity:	85°C / 85% RH, 1000 hrs
PCT / HAST:	130°C, 85% RH, 96 hrs
High temp storage:	150°C, 1000 hrs
Temp cycle:	-55°C / +125°C, 1000 cycles

*Data for 12 x 12 mm body; 176 I/O; 7.62 mm DC die, 0.15 mm thick

Board Level:

Thermal cycle:	-55°C / 125°C 2 cycles/hour, 1000 cycles
First failure 1100 cycles
Lead free solder	SN-Ag (4%) - Cu (0.5%)

Process Highlights:

Die Thickness (max):	150µm
Wire bonding:	Standard; low loop
Die attach adhesive:	Not required
Package marking:	Laser

Standard Materials:

Package substrate:	Thin core FR5 or equivalent
Au wire:	20 µm diameter
Encapsulant:	Standard EMC
Solder balls:	0.3 mm dia. 63Sn / 37Pb & SnAgCu
Top coating:	Conductive epoxy (Optional)

Shipping:

etCSP^® packages are shipped in JEDEC trays or in tape and reel if final electrical testing is performed.

Daisy Chain Availability:

• etCSP 80, 7x7, 0.5mm ball pitch
• etCSP 176, 12x12, 0.5mm ball pitch