With the evolution of smaller, denser, faster and lighter end products, Amkor not only shrunk the SOP by decreasing the lead pitch, but also made it thin - 0.9 mm thin! Amkor invested time and research into assuring quality and reliability with advanced designs, assembly equipment/ processes and materials. The result is controlled package flatness, wire sweep, solderability and delamination resistance. Amkor now makes it possible for IC designers, packaging engineers, circuit designers and component specifiers to work concurrently and succeed with its TSSOP product line.

Applications:

These IC packages are particularly suited for gate drivers, controllers, wireless / RF, op amps, logic, analog, ASICs, memory (EPROM, E²PROM), comparators and optoelectronics. Memory modules, disk drives, recordable optical disks, telephone handsets, speed dialers, video / audio and consumer electronics /appliances are suggested uses for TSSOP packaging.

Features:

TSSOPs from Amkor’s product portfolio presents:

• 8 to 80 lead counts
• 3.0 mm, 4.4 mm and 6.1 mm body sizes
• Max. length: 17.0 mm (80L) / Min. length: 3.0 mm (8L)
• 0.9 mm body thickness for 4.4 & 6.1 mm body
• 0.85 mm body thickness for 3.0 mm body
• Lead Pitch: 0.40 - 0.65 mm
• JEDEC package outline standard MO-153 / MO-197
• Hi-conductivity copper leadframes
• Very low-stress mold compound
• Pre-plated Lead Frame (PPF) available for all TSSOP lead counts
• Multi-Die production; 2 - 4 dies, side by side
• Strip Test available for HDLF strips
• Available in ePad Productions

Mechanical Samples:

For mechanical samples of our TSSOP package, please click here.

Thermal Resistance:

Forced Convection, Single-Layer PCB, JEDEC Standard Test Boards

Theta JA (°C/W) by Velocity

Pkg	Body Size (mm)	0	200	500
16 ld	5.0 x 4.4	137.1	118.2	106.8
20 ld	6.5 x 4.4	114.5	98.0	88.0
28 ld	9.7 x 6.1	82.9	68.7	60.5
48 ld	12.5 x 16.1	82.6	70.3	63.7

Forced Convection, Multi-Layer PCB, JEDEC Standard Test Boards

Theta JA (°C/W) by Velocity

Pkg	Body Size (mm)	0	200	500
16 ld	5.0 x 4.4	89.0	81.8	78.1
20 ld	6.5 x 4.4	73.2	66.6	63.5
28 ld	9.7 x 6.1	49.8	43.9	41.2
48 ld	12.5 x 6.1	58.3	52.3	49.9

Reliability:

Amkor subjects their TSSOP packages to high level testing to assure reliable performance.

HAST:	130°C / 85% RH, No Bias, 96 hours
Temp cycle:	-65 / +150°C, 500 cycles
Temp / Humidity:	85°C / 85% RH, No Bias, 1000 hours

Process Highlights:

Die Thickness (max):	10.5-11.5 mil (4.4 & 6.1 mm body) 7.5-8.5 mil (3.0 mm body)
Strip Solder plating:	85 / 15 Sn/Pb
Strip Marking:	Laser
Lead inspection:	Optical
Pack / ship options:	Bar code / dry pack / TNR
Bond pad pitch:	0.10 mm
Wafer backgrinding:	Available
Coplanarity (max):	0.08 mm

Test Services:

Contact Amkor Test Services for more details.

• Program generation / conversion
• Product engineering support
• Wafer sort
• Ambient to +165°C test available
• Tape and reel services
• Burn-in
• Strip Test

Shipping:

• Clear anti-static tube (20 inch)

Additional Information:

Description	File Type	File Size
TSSOP Data Sheet		407 kb

For more information on the TSSOP package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form.