Amkor’s TapeArray^® package is a near chip scale package (CSP) solution that incorporates the most advanced assembly processes and designs. The package has a die-up, wire bonded configuration with a flexible circuit substrate and an over-molded body. The package is then singulated by saw as part of the EOL process. The fine line features of the tape substrate offer reduced conductor and wirebond finger pitch to offer the highest I/O density solutions for a wide range of applications. The TapeArray^® package is available in ball counts from 48 to 672 and ball pitch ranges from 1.0 mm - 0.5 mm.

Applications:

The TapeArray^® is an excellent choice for applications requiring a small, thin package with reduced footprint and < 1.0 mm ball pitch. In offering higher I/O density and small form factor, the TapeArray^® is targeted toward applications such as hard drives, PDAs, global positioning systems (GPS), PLDs, ASICs, controllers, Flash Memory, digital consumer electronics, wireless telecommunications, and DSPs supporting all portable products.

Features:

Exceptional performance by innovative design provides the following::

• 48 to 672 ball counts
• 5 to 17 mm sq. body sizes
• 1.0, 0.8, 0.65 and 0.5 mm ball pitches
• 63 Sn / 37 Pb eutectic solder balls / Sn 4% Ag 0.5% Cu
• Perimeter and full solder ball arrays
• < 1.1 mm mounted height for 1 mm and 0.8 mm ball pitches
• < 1.0 mm mounted height for 0.5 mm ball pitch
• Excellent solder joint reliability
• Full in-house design
• JEDEC Compliant
  - MO-195 -- 0.5 mm pitch
  - MO-216 -- 0.8 mm pitch
  - MO-192 -- 1.0 mm pitch
  

Mechanical Samples:

For mechanical samples of our TapeArray BGA package, please click here.

Thermal Performance:

 4 Layer PC board, 0 air flow

Body Size (mm)	Die Size (mm)	Theta JA (°C/W)
8 x 8	5.76	33.6
12 x 12	7.77	30.4
15 x 15	7.77	30.1
16 x 16	10.16	26.1

Simulated thermal values for all package sizes available

Electrical Performance:

 8 x 8 mm body, 132 ld, 0.5 mm ball pitch

	Min	Max
Inductance	0.38 nH	1.4 nH
Capacitance	0.14 pF	0.29 pF
Resistance	5 m	75 m

Simulated results @ at 100 MHz

Reliability:

Package Level:

Moisture sensitivity characterization:	JEDEC Level 1 30°C / 85%RH, 96 hours @ 260°C
Moisture sensitivity characterization:	JEDEC Level 2  85°C / 85% RH, 168 hours for  Pb Free and Green packages
Autoclave:	121°C, 2 atm, 168 hours
Temp / Humidity:	85°C / 85% RH, 1000 hours
High temp storage:	150°C, 1000 hours
Temp cycle:	-55°C / +125°C, 1000 cycles

Board Level:

Thermal cycle:	0°C / +100°C, 2 cycles / hour, 2000 cycles
Thermal cycle:	-40°C / +125°C, 1 cycle / hour, 1000 cycles

Process Highlights:

Die thickness:	0.180 ± 0.305 mm
Bond pad pitch (min):	75 µm In-Line,  50 / 100 µm Staggered
Marking:	Laser
Ball inspection:	Optical
Pack options:	Dry pack
Wafer Backgrinding:	Available

Standard Materials:

Package Substrate
-Conductor:	Cu / Ni / Au
-Dielectric:	Polyimide
Die attach adhesive:	Non-Conductive / Conductive
Encapsulant:	Epoxy mold compound
Solder ball:	Eutectic SnPb / Sn Ag Cu

Test Services:

Please contact the Test Services Group for details on the services available including:

• Program Generation / Conversion
• Product engineering support
• Wafer sort
• Burn-in
• 256 Pin x 20 MHz test system available
• -55 °C to + 165 °C test available
• 8 x 8 - 81 P.O.D.