Amkor has a broad portfolio of Small Outline ICs (SOIC) packages, including .150”, .208” and .300” body sizes. Statistically controlled and refined assembly processes coupled with very high quality materials assure the best SOIC packages available for your semiconductor devices. These IC packages have proven surface mount (SMT) performance characteristics and have been designed to adapt easily to all SMT processes and lines.

Amkor’s wide array of SOIC packages provide component and packaging engineers the ability and freedom to optimize systems and product designs. Standard materials for Amkor’s SOIC package family meet the requirements for RoHS, (Pb-free and Green).

For more information on our SOIC and SOJs, please contact an Amkor Regional Sales Office near you or fill out the Request for Information Form.