 |
Metric Quad Flat Pack (MQFP / QFP)
 Amkor’s MQFP package portfolio enables the designer, specifier or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced equipment, material and processes to assure successful, reliable performance of your IC chips. Having a complete line of MQFPs available and at your disposal means security and convenience. Sourcing them from Amkor means success.
Applications:
Amkor’s MQFP line is adapted to meet the increasing challenges of advancing Micro Processors, Micro Controllers, DSP, ASIC, Video DAC, PC Chip Sets, Gate Arrays, Logic, Multimedia Chip Sets and other technologies. These packages fill many end application needs in consumer, commercial, office, automotive, PC, industrial and other product areas.
Thermal Enhancement:
Some designs and applications require an added margin of thermal performance (power). Amkor’s easy and cost-effective solution is a heatspreader. This optional embedded thermal aid improves Theta JA by greater than 15% (without external heatsinks or fans) by increasing the heat dissipation path from the IC chip to the PCB.
Features:
Amkor's MQFP IC package portfolio provides:
- 10 x 10 mm to 40 x 40 mm body size
- 44 to 304 lead counts
- Broad selection of stamped die pad sizes
- Die up and down configurations
- High conductivity copper leadframes
- JEDEC standard compliant
- Integrated thermal enhancement available with heatspreader
- Custom leadframe design available
- Fine pitch wire bond capability
- Lead Free option available
Thermal Resistance:
Multi-Layer (1S2P) PCB, JEDEC Standard Test Boards
| |
|
|
|
|
Theta JA (°C/W)
by Velocity |
| Pkg |
Body Size (mm) |
Pad Size |
0 |
200 |
500 |
| 44 ld |
10 x 10 |
7.4 x 7.4 |
38.4 |
32.1 |
29.4 |
| 64 ld |
14 x 14 |
8.9 x 8.9 |
33.7 |
27.9 |
25.5 |
Electrical:
Simulated Results @100 MHz
| Pkg |
Body Size (mm) |
Lead |
Inductance (nH) |
Capacitance (pF) |
Resistance (m ) |
| 44 ld |
10 x 10 |
Longest |
1.660 |
0.322 |
19.8 |
| 44 ld |
10 x 10 |
Shortest |
1.460 |
0.342 |
17.0 |
Reliability:
Amkor’s MQFPs are reliability assured through optimized design, material and process enabling high performance operation of your IC chip.
| Moisture sensitivity characterization: |
JEDEC Level, 3 30°C / 60%, 192 hours |
| PCT: |
121 °C, 2 atm, 100%RH, 504 hours |
| Temp / Humidity: |
85°C / 85% RH, 1000 hours |
| High temp storage: |
150°C, 1000 hours |
| Temp cycle: |
-65/+150°C, 1000 cycles |
Process Highlights:
| Die Thickness (max): |
25 mil |
| Solder plating: |
85/15 Sn/Pb |
| Marking: |
Laser |
| Lead inspection: |
Laser / Optical |
| Pack/ship options: |
Bar code, dry pack |
Test Services:
- Program generation / conversion
- Product engineering support
- Wafer sort
- 256 pin x 20 MHz test system available
- Burn-in
- -55 °C to +165 °C test available
- Tape and reel services
Shipping:
- JEDEC outline CS-004 low profile tray
- Bakable (125 °C and 150 °C)
- Non-bakable
Configuration Options:
Additional Information:
| Description |
File Type |
File Size |
| MQFP Data Sheet |
|
393 kb
|
For more information on the MQFP package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form. |
|
