Amkor Technology is committed to continuing to service this long established standard industry package. This surface mount package consists of a co-fired ceramic base that has metalized terminals/pads on the sides and bottom of the package. An LCC package has terminals / pads on all four edges of the package. The lid for this package can be either ceramic "frit sealed" or metal "solder sealed". This package provides a hermetic environment for the IC inside.

Applications:

This IC package technology allows application and design engineers to maximize the performance characteristics of semiconductors (silicon, GaAs and S.A.W.). These packages enable end products (pagers, portable audio / video, disc drives, radio, IF & RF devices/components, telecom) to be reduced in size and weight. Semiconductor families such as operational amplifiers, drivers, optoelectronics, controllers, logic, analog, memory, comparators and more using BiCMOS, CMOS or other silicon / GaAs /S.A.W. technologies are well addressed by the LCC product family.

Features:

The LCC offers a variety of features. From standard industry, Amkor provides a platform from prototype-to-production.

• Small package outline
• 8 - 28 lead count
• Design flexibility by working with ceramic manufacturer
• High reliability / good hermeticity (solder seal)
• Flexible lead counts
• Variety of body sizes
• Hermetic package
• Exceptional thermal and electrical performance by design
• Multi-layer, ground / power
• Cavity Up / Cavity down configurations
• Cavity package