This is a ceramic version of the Plastic SSOP package. The CSSOP is a hermetic package consisting of two pieces of dry pressed ceramic surrounding a "gullwing" formed leadframe. This package has leads extending from two sides of the package (dual). The ceramic / LF / ceramic system is held together hermetically by glass. The frit lid is sealed/reflowed over the package cavity at temperatures between 400° - 460° Centigrade.

Applications:

These packages enable end products (pagers, portable audio / video, disc drives, radio, RF devices / components, telecom) to be reduced in size and weight. Semiconductor families such as operational amplifiers, drivers, optoelectronics, controllers, logic, analog, memory, comparators and more using BiCMOS, CMOS or other silicon/GaAs technologies are well addressed by Amkor's CSSOP product family.

Features:

The CSSOP offers a variety of features:

• 20 & 24 lead counts (Others available when tooled)
• 150 mil body size (Others available when tooled)
• Hermetic package
• High thermal conductive ceramic
• Matte Tin Plate lead finish
• JEDEC and EIAJ package outline standard compliant
• Wide selection of cavity sizes to meet most die size needs
• Commercial or full Military flows

For more information on the CSSOP package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form.