Wafer Bumping & Die Level Interconnect Services
Amkor offers state-of-the-art capability in electroplated solder technologies in multiple strategic locations (Taiwan, Korea, Singapore and the US). These locations are uniquely situated adjacent to major foundry sources to enable our customers reduced time to market with integrated factory logistics. This combination of technology and manufacturing capabilities is unparalleled in the subcontract manufacturing industry.
CSPnl™
Wafer Level Packaging
Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. CSPnl™ represents the next level in wafer level chip scale packaging as demonstrated by its proven benchmark reliability. Amkor’s CSPnl™ has been widely adopted as the industry standard for cost effective, reliable, high performance wafer level CSP applications. Our wafer bumping and test offering is an excellent complement to other Amkor product lines.
Press Releases
| 11/20/08 | Amkor Announces Upcoming Investor Events |
| 11/07/08 | Amkor Announces FusionQuad(R) Technology Licensed to ASAT |
| 10/29/08 | Amkor Reports Third Quarter 2008 Results |
| 10/28/08 | Amkor Announces Interim Ruling in Tessera Arbitration and Reports Favorable Results in Alcatel and Motorola Proceedings |
| 08/05/08 | Amkor Reports Second Quarter 2008 Results |
Data Sheets
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