Amkor Technology: Packages by Family

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Packages by Family

Below you will find a list of packages grouped by family. You can exand each section to view the packages that are in each family.

TSSOP / MSOP
With the evolution of smaller, denser, faster and lighter end products, Amkor not only shrunk the SOP by decreasing the lead pitch, but also made it thin - 0.9 mm thin!

ExposedPad SOIC / SSOP
This Amkor developed family of power IC packages significantly increases the thermal efficiency of power constrained standard SOIC and SSOP packages.

ExposedPad TSSOP
This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard TSSOP packages.

TSOP
Amkor offers a full family of popular TSOP packages to serve the needs of IC designers, PCB / system engineers and component specifiers.

Multi-Chip (MCP) & Stacked-Die Leadframe
Amkor's multi-chip package and stacked-die leadframe designs enable package level integration in a low cost, leadframe-based form factor.

SOIC
Amkor has a broad portfolio of Small Outline ICs (SOIC) packages, including .150”, .208” and .300” body sizes.

PowerSOP® 2 & 3 (PSOP / PSSOP)
This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard SOIC packages.

PDIP / SPDIP
Amkor is committed to continuing to service this long established standard industry package. The Amkor PDIP comes in a wide range of lead counts: from 8 - 48 leads with a lead pitch of 100 mils.

SSOP
How do you reduce an SOP size and its board footprint demand? Amkor did it by taking a family of SOPs and shrinking them.

SOT-23 / SC-70
Amkor’s 1.0 mm thick, 5, 6, and 8 lead SOT23 and 5 and 6 lead SC70 packages offer gullwing lead, sub-miniature, SMT performance characteristics.

MicroLeadFrame® (MLF)
Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the PWB.

ExposedPad LQFP / TQFP
This Amkor developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages.

FusionQuad® (VQFP / HVF-PQFP)
Amkor’s FusionQuad® represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad QFP and MLF® technologies. FusionQuad® is based upon the addition of exposed bottom lands within a standard VQFP package format.

LQFP
Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness.

PLCC
Amkor's PLCC offerings cover the total range offered by the industry. It includes all square body packages from 20 lead through 84 lead. Also included is the rectangular body format of the 32 lead.

LQFP PowerQuad® 4
LQFP PowerQuad® 4 (PQ4) is the same Amkor patented, advanced IC packaging technology used in MQFP PQ4s but applied to Low Profile 1.4 mm QFPs (LQFP). Improved power dissipation is achieved by using an exposed copper heatslug.

TQFP
Amkor offers a broad line of TQFP IC packages. IC packaging engineers, component specifiers and systems designers will find our TQFPs help to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability.

MQFP PowerQuad® 4
Systems and applications that operate at moderate levels of power need more power performance than QFPs can deliver. Amkor has developed a low cost package system, available in QFP format, to solve these thermal problems.

Multi-Chip (MCP) & Stacked-Die Leadframe
Amkor's multi-chip package and stacked-die leadframe designs enable package level integration in a low cost, leadframe-based form factor.

System in Package (SiP)
Amkor Technology is committed to being a leader in providing the services necessary to make our customers successful with System in Package technologies.

CASON® (ChipArray SON)
Amkor's CASON packages are laminate-based products available as QFN / QFP (Quad Flat No-Lead) packages.

tsCSP (Thin Substrate CSP)
Amkor's tsCSP is a land grid array multi-row package (up to 3 rows of lands) compatible with established CSP mounting processes. The near-chip-size standard outlines of the tsCSP package offer a broad selection of land pitch, count, and body sizes.

fcCSP (Flip Chip CSP)
Amkor is now offering the Flip Chip CSP (fcCSP) package -- a flip chip solution in a CSP package format. This package construction utilizes eutectic tin / lead (63Sn / 37Pb) flip chip interconnect technology, in either area array or peripheral bump layout, replacing standard wire-bond interconnect.

CABGA | CTBGA | CVBGA
Amkor’s ChipArray® packages are laminate based Ball Grid Array (BGA) packages that are compatible with established SMT mounting processes. The near-chip-size standard outlines offer a broad selection of ball array pitch, count, and body sizes.

Stacked CSP
The Stacked CSP (S-CSP) family utilizes Amkor's industry leading ChipArray® manufacturing capabilities. This broad high volume infrastructure enables the rapid deployment of advances in die stacking technology across multiple products and factories to achieve lowest total cost requirements.

PSvfBGA (Package Stackable Very Thin Fine Pitch BGA)
Amkor has expanded its comprehensive PoP family and aligned the roadmap across the supply chain to ensure that PoP will continue to scale with the industry's miniaturization, higher density and performance enhancement requirements.

PBGA (Plastic Ball Grid Array)
Amkor's PBGAs incorporate the most advanced assembly processes and designs for today's and tomorrow's cost/performance applications.

EPBGA (Enhanced PBGA)
Amkor's Enhanced PBGA (EPBGA) a cavity down package that offers excellent thermal performance.

HPBGA (High Performance BGA)
Amkor's HPBGA packages offer BGA technology in a deep cavity down architecture with multiple wire bonding tiers for power, ground and signals.

FCmBGA (Flip Chip Molded Ball Grid Array)
FCMBGA provides additional benefits such as improved board real estate use, by allowing closer spacing between passives and the flip chip die, better warpage control for thin core substrates and improved solder joint reliability for passives.

TEPBGA (Thermally Enhanced PBGA)
This advanced IC package technology allows application and design engineers to optimize innovations while maximizing the performance characteristics of semiconductors (silicon).

SuperBGA®
The SuperBGA® (SBGA) technology provides a very low profile, high-power BGA package. SuperBGA®'s utilize advanced substrate designs with proven assembly practices and materials to assure your IC complementary performance.

MCM-PBGA (Multi-Chip Module Plastic Ball Grid Array)
The MCM-PBGA (Multi-Chip Module Plastic Ball Grid Array) by Amkor incorporates the latest technology in high-density plastic IC packaging.

Game, Memory and I/O Cards
Amkor offers memory card assembly and test services in various formats; MMC, RS-MMC, MMCmicro, SD, mini-SD, MicroSD, xD Picture, Memory Stick, DUO, USB memory modules to name a few.

VisionPak LCC Image Sensor
Amkor's VisionPak Leadless Chip Carrier (LCC) design offers a high temperature co-fired ceramic (HTCC) ceramic substrate with an optically clear lid. Assembly features fully automated UV epoxy dispensing and precision glass placement, providing the accuracy required in image capture applications.

Camera Module
Amkor's CMOS Image Sensor / Image Display Modules are a complete manufacturing solution that integrates an image sensor / image display die with a DSP, optics, and / or passive components.

SuperFC® (Super Flip Chip)
Amkor's SuperFC® is the high performance flip chip solution. Flip chip interconnect utilizes array interconnect of die to substrate as a replacement for conventional wire bonding.

CSPnl™ (DSBGA/WLCSP/WCSP/WLP) - Wafer Level Packaging
CSPnl™ is a true wafer level CSP package that can incorporate thin film redistribution films to route I/O pads to JEDEC / EIAJ standard pitches, and thereby, avoiding the need to redesign legacy parts for CSP applications.

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