Amkor's tsCSP is a land grid array multi-row package (up to 3 rows of lands) compatible with established CSP mounting processes. The near-chip-size standard outlines of the tsCSP package offer a broad selection of land pitch, count, and body sizes. By utilizing a thin substrate, this package achieves a standard height of 0.4 mm to 0.6 mm. Amkor also offers very thin package thickness less than 0.4 mm.

The package uses Amkor's ExposedPad™ technology as a thermal enhancement by having the die attach paddle exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the PWB. These enhancements also enable stable ground by use of down bonds or by electrical connection through a conductive die attach material.

Regardless of body size and thickness, Amkor tsCSP packages utilize streamlined, flexible manufacturing process to provide economical packaging solutions.

Applications:

Amkor’s tsCSP package is an ideal choice for handheld portable devices such as cell phones and PDAs or other applications requiring small size, light weight, excellent thermal and electrical performance, and low cost.

Typical device applications for Amkor's tsCSP package include hard disk drives, USB controllers, wireless LAN, memory, analog, ASICs, RF devices and simple PLDs.

Features:

• Low NRE cost
• Square or rectangle packages available
• Body sizes less than 2mm SQ and up to 15mm SQ (Qualification required for larger body sizes)
• Ultra thin: 0.25mm to 0.4mm package profile
• High I/O density: 0.5mm, 0.4mm land pitch
• Isolated Power / Ground ring option
• Strip testing capabilities
• No antenna effect for high speed devices
• High MSL performance (L1 / 260 MSL) (Depending on body size)
• Exposed die attach pad for superior thermal performance
• No die attach pad for additional routing under die
• JEDEC MO-247 compliant: Plastic Quad No-lead Staggered Multi-row Packages
• JEDEC Publication 95 Design Guide 4.19 complaint: Quad No-lead Staggered and Inline Multi-row Packages
• Standard Pb Free and Green package

Electrical Simulation:

Values dependant on specific die and wire configurations

Thermal Resistance:

JEDEC Multi-layer PCB; Modeled data @ 0 air flow and 1W power

Reliability:

Amkor’s tsCSP packages are reliability assured through optimized design, material and process.

Process Highlights:

Standard Materials:

Substrate:	Plate-up coreless technology, Au / Ni/ Cu
Die attach:	Conductive Epoxy
Wire:	1.0 mil low loop
Mold compound:	Pb free / Green Capable

Test Services:

• Program generation / conversion
• Product engineering support
• Available test / handling technology
• Tape and Reel Services
• Burn-in capabilities

Shipping:

• This product is shipped in clear anti-static tubes, bakable trays or metal canisters.

tsCSP Package Offerings:

Body Size	0.4 mm Pitch I/O 1-Row / 2-Rows / 3-Rows	0.5 mm Pitch I/O 1-Row / 2-Rows / 3-Rows	0.65 mm Pitch I/O 1-Row / 2-Rows
3	24 / 36 / -	20 / 28 / -	- / -
4	36 / 60 / -	28 / 44 / -	- / -
5	44 / 76 / 96	36 / 60 / 80	- / -
6	56 / 100 / 132	44 / 76 / 104	- / -
7	64 / 116 / 156	52 / 92 / 128	36 / 68
8	76 / 132 / 180	60 / 108 / 152	44 / 76
9	84 / 156 / 216	68 / 124 / 176	48 / 92
10	96 / 172 / 240	76 / 140 / 200	56 / 100
11	104 / 196 / 276	84 / 156 / 224	64 / 116
12	116 / 212 / 300	92 / 172 / 248	68 / 124
13	124 / 236 / 336	100 / 188 / 272	76 / 140
14	136 / 252 / 360	108 / 204 / 296	80 / 148
15	144 / 276 / 396	116 / 220 / 320	88 / 164

tsCSP Cross Sections:

 

 

Additional Information:

Description	File Type	File Size
Thin Substrate CSP (tsCSP) Data Sheet		411 kb

For more information and a product presentation on the Thin Substrate CSP (tsCSP) package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form.