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97% Reliability and Product Analysis Management

Reliability Focus Area Qualifications / Evaluations:New Package, Process, Material and Equipment Qualifications Engineering Studies Customer Requests Competitive Comparisons Establish a construction baseline for component qualification or future analysisDesign or Supplier evaluationSelect vendors and componentsEvaluate new technologies Identify deviations in supplier process or ... /go/about-us/reliability-management/reliability-and-product-analysis-management

96% Amkor Sees Surge in Demand for Advanced Stacked Packages; Plans Aggressive Capacity Expansion in 2004

Amkor Sees Surge in Demand for Advanced Stacked Packages; Plans Aggressive Capacity Expansion in 2004 CHANDLER, Ariz., Jan. 22 -- Citing accelerating demand for advanced semiconductor package solutions for cell phone and other handheld applications, Amkor Technology, Inc. (Nasdaq: AMKR) today announced that it is aggressively expanding capacity for stacked chip-scale packages (S- CSP). Already among the largest producers of ... /index.cfm?objectid=08D9E6F4-0835-B014-2A932DD7B1B5BFC5

95% Amkor's Strip Test: A Better Mousetrap for Testing Low Pin Count IC Packages

Amkor's Strip Test: A Better Mousetrap for Testing Low Pin Count IC Packages CHANDLER, Ariz., Dec. 10-- Amkor Technology, Inc., (Nasdaq: AMKR) today announced that its semiconductor strip test production is on pace to approach 300 million IC packages in 2003, more than double the number of ICs Amkor strip tested in 2002. Strip test is a method of testing large numbers of packaged ICs that both reduces test cost and increases test yield... /index.cfm?objectid=04F8FBA3-C922-31AC-512DEBB946303405

94% Amkor Technology Names Eric Larson Executive Vice President Product Management Group

Amkor Technology Names Eric Larson Executive Vice President Product Management Group CHANDLER, Ariz. – April 10, 2007 -- Amkor Technology, Inc. (Nasdaq: AMKR) today announced that Eric Larson will join the company as Executive Vice President Product Management Group, effective April 14, 2008. Larson, 52, will report to Ken Joyce, Amkor’s Chief Operating Officer, and will have overall management responsibility for Amkor’s Product Business Units, including Wirebond Products, Wafer-Level ... /index.cfm?objectid=08E1F808-C26B-97DE-DD2F8274B441F02F

94% Amkor Technology Partners with Sharp to Unify Stacked Package Designs

Targeting ASICs, DSPs and memories for the cell phone, PDA, digital still camera markets, the two companies will develop and enhance a standard industry stacked package format utilizing Amkor's stackable etCSP(TM) package and Sharp's package stacked CSP. This agreement creates a de facto standard for stacked packaging capabilities, with Sharp offering compact, high density products through ... /index.cfm?objectid=04F8D861-A6AC-98E7-87DFAF4D84B9986B

93% Amkor Japan Qualifies Key Packages for Hot Consumer Products

Amkor Japan Qualifies Key Packages for Hot Consumer Products Enables Japanese IC Companies to Increase Assembly and Test Outsourcing CHANDLER, Ariz., Oct. 29 --Amkor Technology, Inc., (Nasdaq: AMKR) reported today that it has completed qualification for two IC packaging solutions in its J1 factory in Kitakami, Iwate-Prefecture, Japan -- the Stacked Chip Scale Package (S-CSP) and the Very Thin ChipArray® Ball Grid ... /index.cfm?objectid=04F8F173-B089-EB04-1ADA8F2DCD253761

92% Amkor Reports First Quarter 2004 Results

Contact: Jeffrey Luth VP Corporate Communications 480-821-5000, ext. 5130 jluth@amkor.com Selected operating data for the first quarter of 2004 1st Quarter -- Capital expenditures: $171 million -- Depreciation and amortization: $52 million -- Free cash flow * ($47 million) * Reconciliation of free cash flow to the most directly comparable GAAP measure: Net cash provided by continuing operating activities $124 million Less purchases of property, plant... /index.cfm?objectid=08D9F125-F806-D7E8-F5BD87747C50E05B

92% Amkor Again Expanding Capacity for MicroLeadFrame(R) Package to Accommodate Customer Demand

Amkor Again Expanding Capacity for MicroLeadFrame(R) Package to Accommodate Customer Demand CHANDLER, Ariz., Feb. 17 -- Amkor Technology, Inc. (Nasdaq: AMKR) said today that it is again increasing production capacity for its MicroLeadFrame® (also known as MLF®) family of semiconductor packages. Amkor's MLF® package is a lead frame-based, near-chip-scale package with an exposed die paddle and leads on the bottom of the package providing excellent thermal and electrical performance... /index.cfm?objectid=08D9E9F2-BAA8-130C-CB5B740CA0E6D840

92% Quality Management

Quality Policy:"Delighting our customers beyond expectation through continuous improvement withinnovative quality products and services that perform reliably over time" Ten Guiding Quality Principles:1.) The customer is the judge of our Quality. ... /go/about-us/quality-management/quality-management

92% Wafer Bumping Processes & Die Level Interconnect

Wafer Size: 150 mm - 300 mm Solder Compositions: 63Sn/37Pb, 95Pb/5Sn, 97.5Sn/2.5Ag (all available as low alpha: <0.02 cts/hr/cm2), SnAgCu Pad Pitch Lower Limit: 85 µm Typical Production Bump Height: 200 µm array: 90 µ... /go/turnkey-services/wafer-bumping/wafer-bumping-processes-and-die-level-interconnect

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