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What's New - 120 Days

APRIL 2008

04/16/2008 The Amkor "Introducing FusionQuad™ : Amkor’s Breakthrough Packaging Technology." Advertisement has been posted.
04/16/2008 The Amkor Technology 2007 Annual Report has been posted.
04/16/2008 The Charter for the Audit Committee of the Board of Directors of Amkor Technology has been updated.
04/04/2008 The Amkor Technology Corporate Brochure has been updated.
04/03/2008 The Application Notes for Preliminary Surface Mount for FusionQuad™ Package has been updated.

MARCH 2008

03/26/2008 The Application Notes for Preliminary Surface Mount for FusionQuad™ Package has been updated.
03/18/2008 The CSPnl™ Wafer Level Package Data Sheet has been updated.
03/18/2008 The CSPnl™ Bump on Pad (BOP) Wafer Level Package Data Sheet has been updated.
03/18/2008 The CSPnl™ Bump on Repassivation / Redistribution Wafer Level Package Data Sheet has been updated.
03/18/2008 The article, "Package-on-package (PoP) with Through-mold Vias” By Christopher Scanlan, Amkor Technology has been posted.
03/17/2008 The Application Notes for Preliminary Surface Mount for FusionQuad™ Package has been updated.
03/17/2008 The Amkor Technology Philippines, Inc. ISO 9001 (ATP - P1-P2) Factory Certification has been posted.
03/17/2008 The Amkor Technology Philippines, Inc. ISO 9001 (ATP - P3-P4) Factory Certification has been posted.
03/17/2008 The Amkor Technology Korea, Inc. ISO 9001 (ATK - K1) Factory Certification has been posted.
03/17/2008 The Amkor Technology Korea, Inc. ISO 9001 (ATK - K3) Factory Certification has been posted.
03/17/2008 The Amkor Technology Korea, Inc. ISO 9001 (ATK - K4) Factory Certification has been posted.
03/17/2008 The Amkor Technology Philippines, Inc. TS 16949 (ATP - P1-P2) Factory Certification has been posted.
03/17/2008 The Amkor Technology Philippines, Inc. TS 16949 (ATP -P3-P4) Factory Certification has been posted.
03/17/2008 The Amkor Technology Korea, Inc. TS 16949 (ATK - K1) Factory Certification has been posted.
03/17/2008 The Amkor Technology Korea, Inc. TS 16949 (ATK - K3) Factory Certification has been posted.
03/17/2008 The Amkor Technology Korea, Inc. TS 16949 (ATK - K4) Factory Certification has been posted.
03/07/2008 The Application Notes for Preliminary Surface Mount for FusionQuad™ Package has been posted.

FEBRUARY 2008

02/28/2008 The Amkor Technology Korea, Inc.OHSAS 18001 (ATK - K1) Factory Certification has been posted.
02/28/2008 The Amkor Technology Korea, Inc.OHSAS 18001 (ATK - K3) Factory Certification has been posted.
02/28/2008 The Amkor Technology Korea, Inc.OHSAS 18001 (ATK - K4) Factory Certification has been posted.
02/22/2008 The White Paper: "FusionQuad™: Novel Leadframe Based Package Provides Performance Boost for Hard Disk Drive Data Transfer Performance” By Tim Olson of Amkor Technology. Bill Rugg of Seagate Technology. Presented at the Pan Pacific Microelectronics Symposium; January, 2008 has been posted.
02/22/2008 The Amkor Technology Corporate Wafer Bumping Video has been posted.

JANUARY 2008

01/30/2008 The Amkor Chandler Test Development Service Sheet has been posted.
01/28/2008 The Amkor Factory Certifications Status has been updated.
01/28/2008 The Amkor Technology Taiwan, Inc.OHSAS 18001 (ATT - T5) Factory Certification has been posted.
01/21/2008 The PSvfBGA (Package on Package) Dual Sided Test Contactor Data Sheet has been posted.
01/21/2008 The FusionQuad™ Test Contactor Data Sheet has been posted.
01/18/2008 Amkor announces our new package called FusionQuad™! The FusionQuad™ represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad™ QFP and MLF® technologies. FusionQuad™ is based upon the addition of exposed bottom lands within a standard VQFP package format. The Preliminary FusionQuad™ information and data sheet has been posted.
01/18/2008 The CSPnl™ Wafer Level Package Data Sheet has been updated.
01/18/2008 The CSPnl™ Bump on Pad (BOP) Wafer Level Package Data Sheet has been updated.
01/18/2008 The CSPnl™ Bump on Repassivation / Redistribution Wafer Level Package Data Sheet has been updated.
01/14/2008 The Amkor Sales, Factory and Customer Service Contact Information Directory has been updated.
01/11/2008 The Wafer Bumping Processes and Die Level Interconnect Technology Services Sheet has been updated.
01/03/2008 The Amkor Technology Corporate Fact Sheet has been updated.
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