TEMPE, Ariz., December 14, 2016 – Amkor Technology Inc. (Nasdaq: AMKR) today announced completion of product qualification for its innovative new Silicon Wafer Integrated Fan-Out Technology (SWIFT™). SWIFT is designed to handle the demanding requirements of today’s advanced mobile, networking and system-in-package (SiP) applications.

With its fine-feature photolithography and thin film dielectrics, SWIFT bridges the gap between through silicon via (TSV) and traditional wafer level fan-out (WLFO) packages. Compared to laminate-based substrate technologies, SWIFT offers dramatic improvements in form factor, signal integrity, power distribution and thermal performance. SWIFT incorporates an “RDL first” process that allows SWIFT wafers to be built and yielded ahead of the assembly process - accelerating production cycles and optimizing overall assembly yield.

“The semiconductor industry requires much higher levels of integration in a significantly reduced form factor,” said Ron Huemoeller, Amkor’s corporate vice president, Research & Development. “Completing the product qualification stage of SWIFT is an important milestone. We achieved success by leveraging our significant fan-out development experience and using our existing cutting-edge equipment. Our package and board-level reliability results demonstrate that SWIFT is ready for sampling by customers.”
 
SWIFT was named the “Device of the Year” at the 3D InCites Awards ceremony earlier this year.  It was recognized for being “uniquely developed to deliver a high yielding, high-performance package with the thinnest profile in the industry.” SWIFT was also noted for its ability to deliver 2µm line/space lithography (with up to four layers of RDL) and a very dense network of memory interface vias at a very competitive price.

SWIFT is targeted for production in the second half of 2017 at K5, Amkor’s state-of-the-art manufacturing, research and development center in Incheon, South Korea. 

About Amkor Technology

Amkor Technology Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes more than 8 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. For more information, visit www.amkor.com.

Media Contact:                                

Debi Polo                                
Amkor Technology, Inc.                            
480-786-7653                            
debi.polo@amkor.com                        

Reader Contact:

Curtis Zwenger
Amkor Technology, Inc.
480-786-7551
curtis.zwenger@amkor.com