CHANDLER, Ariz. - May 16, 2013 - Amkor Technology, Inc. (Nasdaq: AMKR) today announced that it will participate in the Barclays 2013 High Yield Bond and Syndicated Loan Conference on Tuesday, May 21, 2013. Amkor’s presentation will occur at 11:30 am Central Time (12:30 pm Eastern Time) at the JW Marriott in Chicago, IL.
An audio-only webcast of the presentation will be made available, both live and by replay, on the Investor Relations section of Amkor’s website.
Amkor is a leading provider of semiconductor packaging and test services to semiconductor companies and electronics OEMs. More information about Amkor is available from the company's filings with the Securities and Exchange Commission and at Amkor's website: www.amkor.com.
Amkor Technology, Inc.
Senior Director, Investor Relations and Corporate Communications