Amkor is the leader in next generation package design.

Amkor's World Class Design Center has been designing semiconductor packages for decades and process thousands of new designs from our large customer base every year.  As a result, we have an unparalleled level of package design expertise and can provide best in class leadframe, laminate, or a wafer level designs services, including the following:

• High quality, reliable, and cost effective designs
• DFM (Design For Manufacturing) and DFC (Design for Cost)
• Highly trained and experienced design staff
• Excellent customer design collaboration to meet thermal, electrical, and mechanical requirements
• Design automation and support
• Use of state-of-the-art design software
• Design Chain Management and Design Chain Optimization

Amkor World Class Design Center Locations

Amkor’s World Class Design Centers are strategically located in the United States, South Korea, Philippines, China and Taiwan. We provide expertise in all aspects of package design beginning with our existing product line through our next generation technology. Our worldwide design team works together to ensure our customers receive fast, courteous and professional design services.

For more information on our Value Added IC Package Design Services, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form.