CHANDLER, Ariz. -- Amkor Technology, Inc. (Nasdaq: AMKR) announced today that it will introduce its highly anticipated next generation package on package (PoP) platform at the IMAPS Device Packaging Conference March 9–12 in Scottsdale, AZ. This new PoP platform uses Amkor’s proprietary through mold via (TMV™) interconnect technology to meet challenging next generation high density PoP requirements.
"3D packaging and PoP represent real bright spots for the electronics industry. We are seeing a strong trend for integration of communications, computing and entertainment features into new mobile multimedia devices. We expect these applications to require higher density signal processing and memory capacities while striving to retain the logistics benefits the PoP architecture provides," said Lee Smith, vice president of business development at Amkor.
Amkor’s TMV™ PoP technology is expected to provide several key benefits:
“Amkor has been investing in the building blocks of our TMV™ approach for a number of years and we are pleased to bring this powerful new technology to market,” commented Tim Olson, senior vice president of R&D and emerging technologies for Amkor. “We have successfully passed our internal qualification and are making preparations to support our ramp into production. We have also initiated the JEDEC registration process to facilitate industry standardization.”
Amkor Technology, Inc. (Nasdaq: AMKR) is a leading provider of semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company's SEC filings. Additional technical information on Amkor’s PoP family including TMV™ packages can be found on: www.amkor.com.
Forward-Looking Statement Disclaimer
This press release contains forward-looking statements within the meaning of federal securities laws. All statements other than statements of historical fact are considered forward-looking statements including, without limitation, statements regarding the signal processing and memory requirements for future devices and the key benefits of our TMV™ PoP package for new 3D architectures. Important risk factors that could affect the outcome of the events set forth or implied in these statements and that could affect our operating results and financial condition are discussed in the Company’s Annual Report on Form 10-K for the year ended December 31, 2008 and in the Company’s subsequent filings with the Securities and Exchange Commission made prior to or after the date hereof. Amkor undertakes no obligation to review or update any forward looking statements to reflect events or circumstances occurring after the date of this press release.
TMV is a trademark of Amkor Technology, Inc.
Amkor Technology, Inc.
Lee Smith, 480-821-5000 ext. 5318