PSvfBGA (Package Stackable Very Thin Fine Pitch BGA)
PSfcCSP (Package Stackable Flip Chip CSP)
TMV® PoP (Through Mold Via Package on Package)

PSvfBGA PoP PSfcCSP PoP TMV Package on Package

Bottom PoP Technologies:

Amkor launched the popular Package Stackable Very Thin Fine Pitch BGA (PSvfBGA) platform in 2004. PSvfBGA supports single die, stacked die using wirebond or hybrid (FC plus wirebond) stacks and has been applied to Flip Chip (FC) applications to improve warpage control and package integrity through test and SMT handling.

As handheld microprocessors have transitioned to advanced CMOS nodes with higher speed cores with higher I/O, there has been a transition from wirebond to flip chip die designs. Flip chip enables the use of an exposed die bottom package that integrates the package stacking design features of PSvfBGA in a fcCSP assembly flow, which Amkor calls Package Stackable Flip Chip Chip Scale Package (PSfcCSP). PSfcCSP has a thin exposed flip chip die enabling fine pitch stacked interfaces at 0.5 mm pitch which is a challenge in a center molded PSvfBGA structure.

Continued development resulted in Amkor entering the second generation of PoP applications where new memory architectures, required in mobile multimedia applications, demand higher density stacked interfaces in combination with PoP mounted area and height reductions. The previous PSvfBGA and PSfcCSP structures limited the ability of the memory interface to scale in density and pitch, resulting in the need for a new bottom PoP structure.

Amkor developed new technologies to create the next generation PoP solution with interconnect vias through the mold cap, naming this technology Through Mold Via (TMV®).TMV technology provides a stable bottom package that enables use of thinner substrates with a larger die to package ratio. TMV enabled PoP can support single, stacked die or FC designs. TMV is an ideal solution for the emerging 0.4 mm pitch low power DDR2 memory interface requirements and enables the stacked interface to scale with solder ball pitch densities to 0.3 mm pitch or below.

The next few years promise to provide many new challenges and applications for PoP, as handheld multimedia applications continue to demand higher signal processing power and data storage capabilities. Amkor is committed to maintaining strong development and production capabilities to ensure we are at the forefront in meeting next generation PoP requirements.

PoP Applications:

Package-on-Packages are designed for products requiring efficient memory architectures including multiple buses and increased memory density and performance, while reducing mounted area. Portable electronic products such as mobile phones (baseband or applications processor plus combo memory), digital cameras (image processor plus memory), PDAs, portable media players (audio/graphics processor plus memory), gaming and other mobile applications can benefit from the combination of stacked package and small footprint offered by Amkor's industry leading PoP family.

PSvfBGA Features:

  • 10-15 mm body sizes tooled per product table, additional sizes based on demand
  • Top package I/O interface 0.65 mm pitch accommodating 104 to 160 pin counts
  • Wafer thinning / handling < 100 μm
  • Mature PoP platform with consistent product performance and reliability
  • Package configurations compliant with JEDEC standards
  • Bottom PSvfBGA and top Flip Chip BGA (FBGA) / Stacked CSP packages are well established in high volume production with multi-region and factory support
  • Standard RoHS and Green Material Sets Available
  • Stacked package heights of 1.3 mm to 1.5 mm available in a variety of configurations (See Stack Up Table below)

 

Broad Benefits of PoP as an Enabling Technology

PoP offers OEMs and EMS providers a flexible platform to cost effectively integrate logic plus memory devices in a 3D stacked architecture. Integration through PoP provides technical and business / logistics benefits:

  • Greatly expands device and supplier options by simplifying the business logistics of stacking
  • Integration controlled at the system level to best match stacked combinations including memory architecture with the system requirements
  • JEDEC standards ensure broad component availability
  • Improving time-to-market, inventory management and supply chain flexibility
  • Eliminates margin stacking and expands technology reuse
  • Provides the lowest total cost of ownership where complex 3D integration of logic plus memory is required

 

Package-on-Package Reliability Qualification:

Amkor assures a reliable performance by continuously monitoring key indices:

Package Level:  
Moisture Resistance Testing:   JEDEC Level 3 @ 260°C x 4 reflows
Additional Test Data:   30°C / 85% RH, 96 hrs @ 260°C x4
Temp Cycle:   -55 / +125°C, 1000 cycles
Temp / Humidity:   85°C / 85% RH, 1000 hours
High Tempature Storage:   150°C, 1000 hours
HAST:   130°C, 85% RH, 96 hours

 

Board Level:  
Thermal Cycle:   -40 / +125°C, 1000 cycles

 

Package Dimensions:  
PSvfBGA: 10 x 10 mm to 15 x 15 mm
PSfcCSP: 12 x 12 mm to 13 x 13 mm
TMV® PoP: 12 x 12 mm to 14 x 14 mm

 

Process Highlights:

Die thickness:   75 µm to 125 µm
Bond pad pitch (min):   45 µm (In-line)
Marking:   Laser
Wafer thinning:   200 mm & 300 mm wafers


Standard Materials:

Package Substrate  
  -Conductor:   Copper
  -Dielectric:   Thin core FR5 or equivalent
Die attach adhesive:   Conductive or non conductive
Encapsulant:   Epoxy mold compound
Solder ball:   Pb free


Test Services:

  • Program Generation / Conversion
  • Product Engineering
  • Dual sided contactor system available


Shipping:

  • Tape and Reel services
  • JEDEC trays

 

PSvfBGACross Section 1

 

PSfvBGA Design Table for 0.65mm pitch 2 row Stacked Interfaces

A B B C D E  
Body Size (mm) Package Interconnect Matrix Package Interconnect Ball Count Bottom Package Ball Count Die Size (mm) Pkg Interconnect ball center to package edge (mm) Typical Wirecount for given pkg size
10 15 104 300 < 5.50 0.450 320
11 16 112 350 < 6.00 0.625 360
12 18 128 400 < 7.50 0.475 420
13 19 136 450 < 8.00 0.650 460
14 21 152 550 < 9.00 0.500 520
15 22 160 650 < 10.00 0.675 600
  • Dimensions are in line with JEDEC JC-11 standards for PoP packages in development
  • Assuming 2 perimerter rows of interconnects at 0.65 mm pitch
  • Assuming 4 perimeter rows of BGA balls to motherboard at 0.50 pitch



PSvfBGA Cross Section 2



PSvfBGA Cross Section 3



PSfcCSP Cross Section


PSfcCSP Design Table for 0.5mm pitch 2 row Stacked Interfaces

Body Size
(mm)
Package Interconnect
Matrix
Package Interconnect
Ball Count
Die Size
10 19 136 < 6.00
11 21 152 < 7.00
12 23 168 < 8.00
13 25 184 < 9.00
14 27 200 < 9.50
15 29 216 < 10.00

 



TMV PoP Cross Section


TMVTM Design Table 0.4mm pitch 2 row Stacked Interfaces

A B B C D D
Body Size (mm) Package Interconnect -
2 row Matrix
Package Interconnect -
2 row Top Ball Count
Bottom Package Ball Count
0.4mm pitch (Full Matrix)
Max. Die Size (mm)
Flip Chip
Max. Die Size (mm)
Wirebond
10 23 168 529 7.00 6.00
11 26 192 676 8.00 7.00
12 28 208 784 9.00 8.00
13 31 232
961 10.00 9.00

 

 

TMV PoP Stackup

TMVTM PoP Overall Stackup Table

Symbol Unit Min Max Nom
A1 (Mounted,
0.4 pitch)
mm 0.100 0.200 0.150
A2 (4L laminate) mm 0.220 0.300 0.210
A3 (Mold cap) mm 0.230 0.280 0.250
B1 (Stacked gap) mm 0.020 0.080 0.050
B2 (2L laminate) mm 0.100 0.160 0.130
B3 (Mold cap) mm 0.370 0.430 0.400
Overall Package Height mm 1.140 1.340 1.240

 

PoP Overall Stack Up Table

Package-on-Package Overall Stack-Up Table

 SymbolUnit Min Max Nom
A1 (mounted, 0.5 pitch)
mm
0.180
0.280
 0.230
A2 (4L laminate)
mm
0.260
0.340
 0.300
B1 (stacked, 0.65 pitch), single die
mm
0.270
0.330
 0.300
B2 (stacked, 0.65 pitch), 2+0 die
mm
0.320
0.380
 0.350
B3 (2L laminate)
mm
0.100
0.160
 0.130
B4 (mold cap)
mm
0.370
0.430
 0.400
 Overall Package Height mm1.300 1.500 1.400

 
For more information on PSvfBGA, PSfcCSP and TMV PoP please contact an Amkor Regional Sales Office near you or fill out the Request Form.

Packaging



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