CHANDLER, Ariz. and DALLAS, July 7 -- Amkor Technology, Inc. (Nasdaq:AMKR) and Texas Instruments Incorporated (TI) (NYSE:TXN) today announced they have qualified and begun production of the industry's first fine pitch copper pillar flip chip packages – shrinking bump pitch up to 300 percent compared to current solder bump flip chip technology. Co-developed to lower the packaging costs of integrated circuit (IC) devices with fine pitch input/output (I/O) pad structures of less than 50 microns (um), the proprietary technology platform also boosts performance, making it ideal for wireless and embedded processing applications based on plated copper pillar bumping and assembly technology.
"As chip I/O density increases with each process node, we had to find a way to decrease the distance between pins," said Tom Thorpe, TI vice president and manager of external development and manufacturing (EDM). "Working together, Amkor and TI rapidly developed, qualified and deployed a new package platform that will not only address TI's flip chip package needs for the next decade but will also serve as a game changer for the industry. This new packaging technology will drive down the size and cost of semiconductors while boosting performance – a win for TI, Amkor and our customers."
"Amkor and TI worked tirelessly to bring this complex technology to market against a challenging development timeline," said Ken Joyce, president and CEO of Amkor Technology. "Both organizations mobilized significant resources to advance the state of the art for copper pillar bumping, fine pitch interconnect assembly, and advanced packaging. We are committed to partnering with TI in applying this new technology on chip scale packages (CSP), conventional package on package (PoP), and next generation TMV™ PoP configurations."
This new lead free technology enables the use of flip chip interconnection at fine pad pitches (50 um and smaller) using fine pitch copper pillar bumping and a newly developed assembly process. Additionally, this technology acts as the platform interconnect technology for integration with next generation advanced silicon nodes.
The fine pitch flip chip layout design methodology typically reduces substrate layer count as compared to standard area array flip chip, yielding a low cost package solution. The fine pitch flip chip package was developed for very thin die, which, when combined with the low standoff height of the copper pillar bump itself, reduces package height.
Amkor is a leading provider of semiconductor assembly and test services to semiconductor companies and electronics OEMs. More information on Amkor is available from the company's SEC filings and on Amkor's website: www.amkor.com
Texas Instruments (NYSE:TXN) helps customers solve problems and develop new electronics that make the world smarter, healthier, safer, greener and more fun. A global semiconductor company, TI innovates through design, sales and manufacturing operations in more than 30 countries. For more information, go to www.ti.com.
This press release contains forward-looking statements within the meaning of federal securities laws. All statements other than statements of historical fact are considered forward-looking statements including, without limitation, statements regarding the use of fine pitch copper pillar packaging in TI products, and reductions in the size and cost of semiconductors. Important risk factors that could affect the outcome of the events set forth or implied in these statements and that could affect the operating results and financial conditions of either Amkor or TI are discussed in the companies' respective Annual Reports on Form 10-K for the year ended December 31, 2009 and in the subsequent filings with the Securities and Exchange Commission made prior to or after the date hereof. Neither company undertakes any obligation to review or update any forward-looking statements to reflect events or circumstances occurring after the date of this release.