CHANDLER, Ariz. May 18, 2010 — Amkor Technology, Inc. (Nasdaq: AMKR) today announced that it has received a Supplier Excellence Award from Altera Corporation. This award recognizes Amkor for outstanding partnership and support in development of copper wire bonding solutions
“This award represents a significant accomplishment in our business partnership and technical collaboration with Altera,” said Ken Joyce, president and CEO of Amkor. “A strong business partnership is critical to developing and deploying new process technologies across the range of products Altera seeks from us. We believe our 29mm BGA product with over 800 wires and nearly two meters in total wire length is a significant milestone for high-volume copper wire bonding.”
Bill Hata, senior vice president for world-wide operations and engineering at Altera commented, “There is a clear need for copper wire bonding on high density laminate packages. We chose Amkor as our partner due to their history of advanced technology capabilities and execution excellence. Amkor has successfully delivered high performance packages with excellent reliability at competitive copper wire bond price points for our low cost Cyclone IV FPGA family.”
About Amkor's Copper Wire Bonding Capabilities
Amkor has had copper wire bonding qualified with customers since 2007 and in production since 2008. Our copper wirebond capabilities range from the low wire density small outline (SO) family, through high wire density PBGA packages. Our experience covering multiple factories, wafer nodes and package types, enables us to help customers like Altera convert to copper wire in high reliability applications.
Amkor is a leading provider of semiconductor assembly and test services to semiconductor companies and electronics OEMs. More information on Amkor is available from the company’s SEC filings and on Amkor’s website: www.amkor.com.
Amkor Technology, Inc.
Sr. Director, Corporate Communications
480-821-5000, ext. 5499