CHANDLER, Ariz. -- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced that it has received the 2011 Excellent Service Provider Award from Semiconductor Manufacturing International Corporation (SMIC) at a ceremony held at SMIC’s Shanghai, China headquarters. Dr. John Liu, SMIC’s Senior Vice President Central Engineering and Services, presented the award to Amkor.
SMIC presents its Excellent Service Provider Awards to its top ranking suppliers each year. The criteria evaluated in choosing the award recipients include quality, price, on-time delivery, technical support, logistics and customer service. Amkor provides SMIC with 200mm wafer bumping and full turn-key wafer-level CSP services, including probe, 200mm wafer bumping and die processing services.
“We are honored to receive this award from a valued customer like SMIC,” said ChoonHeung Lee, Amkor’s corporate vice president, product management. “I am certainly proud of our team in Amkor Technology China. At Amkor, we place a high priority on our customers and meeting their needs for leading-edge wafer bumping and full turn-key wafer-level CSP services that enable them to excel in their markets.”