Chandler, Ariz., July 23, 2009 — Amkor Technology, Inc. (NASDAQ: AMKR) today announced that Jim Fusaro has been appointed as Executive Vice President to lead an integrated Assembly and Test Business Unit that includes Wirebond Products, Wafer-Level-Processing and Flip-Chip Products, Test Services and Advanced Product Development.
Jim Fusaro joined Amkor in 1997 and has served in various senior management positions during his time with the company. Prior to joining Amkor, Jim worked as a senior engineer for another semiconductor products company and also spent nine years in the Aerospace sector. “We are fortunate to have someone like Jim with the right combination of strong leadership skills, technical expertise and commercial experience to take on this challenging new position,” commented Ken Joyce, the company’s President.
Mike Lamble has also been promoted to Executive Vice President in charge of Worldwide Sales and will continue to report to Mr. Joyce. Mike joined Amkor in 1992 and has served in various senior sales management positions during his time with the company.
Amkor is a leading provider of semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronics design and manufacturing services. More information on Amkor is available from the company’s SEC filings and on Amkor’s website: www.amkor.com.
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