CHANDLER, Ariz. – June 24, 2013 - Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced that it has received the 2012 Excellent Service Provider Award from Semiconductor Manufacturing International Corporation (SMIC), the second consecutive year Amkor has earned this award.  Ms. Ann Liu, SMIC’s director of corporate turnkey services, presented the award to Amkor at a ceremony held at Amkor’s Shanghai, China facilities.

“We value our supplier partnership with SMIC and it is an honor to receive their Excellent Service Provider award for the second consecutive year,” said ChoonHeung Lee, Amkor’s corporate vice president, business and technology.  “At Amkor, we place a high priority on meeting our customers’ needs for the leading-edge wafer bumping and full turn-key wafer-level CSP services that enable them to excel in their markets.  We are pleased with the efforts made by our team in Amkor Technology China to achieve this high level of customer satisfaction.”

SMIC presents its Excellent Service Provider Awards to its top ranking suppliers each year.  The criteria evaluated in choosing the award recipients include quality, price, on-time delivery, technical support, logistics and customer service. Amkor provides SMIC with 200mm wafer bumping and full turn-key wafer-level CSP services, including probe, 200mm wafer bumping and die processing services.

About Amkor

Amkor is a leading provider of semiconductor packaging and test services to semiconductor companies and electronics OEMs.  More information on Amkor is available from the company's SEC filings and at Amkor's website:  www.amkor.com

Contact

Amkor Technology, Inc.
Greg Johnson
Senior Director, Investor Relations and Corporate Communications
480-786-7594
greg.johnson@amkor.com