CHANDLER, Ariz. -- May 7, 2014 -- Amkor Technology, Inc. (Nasdaq: AMKR) today announced that it will participate in the Barclays High Yield Bond and Syndicated Loan Conference on Tuesday, May 13, 2014. Amkor’s presentation will occur at 7:30 am Pacific Time (10:30 am Eastern Time) at the Arizona Biltmore Hotel in Phoenix, Arizona.

An audio-only webcast of the presentation will be made available, both live and by replay, on the Investor Relations section of Amkor’s website.

About Amkor


Amkor is a leading provider of semiconductor packaging and test services to semiconductor companies and electronics OEMs. More information about Amkor is available from the company's filings with the Securities and Exchange Commission and on Amkor's website: www.amkor.com.

Contacts


Greg Johnson
Senior Director, Investor Relations and Corporate Communications
Amkor Technology, Inc.
480-786-7594
greg.johnson@amkor.com