MOUNTAIN VIEW, Calif., August 20, 2009 -- Based on its recent analysis of the advanced electronic packaging market, Frost & Sullivan recognizes Amkor Technology, Inc. with the 2009 Global Frost & Sullivan Technology Innovation of the Year Award for its line-up of innovative new products, including through mold via package on package (TMV(TM) PoP), FusionQuad®, and flip chip molded ball grid array (FCMBGA). Amkor delivers tailored, application-specific package design, as well as assembly and test solutions, and is a leading source for many of its customers' integrated circuit (IC) packaging assembly and test requirements.
FusionQuad® represents a breakthrough in lead frame-based plastic packaging, which provides a cost-effective platform for increased lead counts in a standard QFP form factor. FusionQuad® provides excellent electrical and thermal performance along with a reduction in packaging size. FusionQuad® applications include a wide range of devices such as hard disk drives, laptop PCs, Ethernet communication, digital television, and data conversion. It offers outstanding performance in a high-density, cost-effective, lead frame plastic package.
"FCMBGA is the advanced and improved version of Amkor's Super Flip Chip (SuperFC®) high performance platform," says Frost & Sullivan Research Analyst, Karthik Kamalakannan. "This technology provides multiple benefits, including improved board space usage, by allowing closer spacing between passive components and the flip chip die resulting in smaller body size and cost savings."
Other benefits of FCMBGA are reduced warpage, enabling use of thin core substrates, and improved solder joint reliability. This packaging technology's flexibility makes it a reliable solution in applications that require robust and cost-effective high pin count flip chip packaging in harsh thermal applications. FCMBGA is targeted for use in networking and storage, gaming, broadband communications, computer, multimedia, and many other applications.
TMV(TM) PoP, Amkor's latest offering, is a novel product for next generation package on package applications. It is designed to address challenging 3D architecture requirements in handheld multimedia products enabling higher signal processing and memory densities. TMV(TM) PoP provides superior interconnect and form factor benefits to IC and system designers alike.
"TMV(TM) PoP allows for thinner bottom packages that offer a larger die-to-package ratio, and has shown significant improvement in warpage control with up to a 30 percent increase in die-to-package size," notes Karthik. "TMV(TM) also removes the solder ball pitch versus stack height limitations seen in current PoP technologies and will allow the stacked interface to scale down to 0.3mm pitch supporting high density roadmap requirements."
Amkor has built a reputation for introducing innovative IC packaging technologies to the semiconductor industry, proving its long-term commitment to R&D. As the time-to-market demand is increasing across semiconductor applications, the company has applied a cross-functional co-development approach to new packaging development that integrates R&D, factory, business development, and product management experts.
Each year, Frost & Sullivan presents this award to the company (or individual) that has carried out new research, which has resulted in innovation(s) that have or are expected to bring significant contributions to the industry in terms of adoption, change, and competitive posture. This award recognizes the quality and depth of a company's research and development programs as well as the vision and risk-taking that enabled it to undertake three major new package platform launches in the past year.
Frost & Sullivan's Best Practices Awards recognize companies in a variety of regional and global markets for demonstrating outstanding achievement and superior performance in areas such as leadership, technological innovation, customer service, and strategic product development. Industry analysts compare market participants and measure performance through in-depth interviews, analysis, and extensive secondary research in order to identify best practices in the industry.
Amkor Technology, Inc. (Nasdaq: AMKR) is a leading provider of semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company's SEC filings. Additional technical information on the above referenced packages can be found on: www.amkor.com.
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