TSON8-FL (Flat Lead) is a smaller power discrete package (3.3 x 3.3 mm) with thermally enhanced that gives a 64% reduction in ootprint area compared with standard SOIC 8 ld package, et an equivalent maximum permissible power dissipation capability.

TSON8FL Power DiscreteThis package may also be know as:

  • TSON-Adv
  • PowerFLAT™ 3.3 x 3.3
  • TSDSON
  • miniHVSON
  • PowerPAK® 1212-8
  • JEDEC: MO240 BA

 

Application

TSON8-FL is suitable for medium-power applications, esigned for low on-resistance and high-speed-switching MOSFETs:Battery protection circuits

  • Notebook PCs
  • Portable electronic devices
  • DC-DC converters

 

Features

  • Small and thermally enhanced package with the same ower dissipation but 64% less footprint area than SOIC 8 ld
  • Dual Cu Clip interconnect for better heat dissipationefficiency
  • Al strap + wire option is also available
  • Turnkey with test and packing services
  • Green materials: Pb-free plating & halogen free mold compound

 

New Developments

  • Dual exposed pad for better thermal performance
  • Thin wafer dicing with narrow saw streets
  • Larger/higher density leadframe strips
  • Environmentally friendly Pb-free solder paste

 

Process Highlights

  • Bare copper leadframe with no plating
  • Die attach: 55 um thin die pick up capability
  • Interconnect: Cu clips technology for better electrical and thermal performance. Also available on Al strap + wire option.
  • Plating: 100% matte Sn
  • Marking: Pen type laser

 

Standard Materials

  • Leadframe: Bare copper
  • Die attach: Solder paste* (*Apply to option dual Cu clips.)
  • Interconnect: 2 option,
  • Dual Cu clips
  • Al strap + wire 2 mil Cu
  • Mold compound: Halogen free

 

Reliability Qualification

Amkor devices are assembled with proven reliable semiconductor materials.

  • All test include pre-condition of: Ta = 85°C/Rh = 85%, 72 hrs with IR reflow Ta = 265°C, 2X
  • High Temperature Storage, Ta = 150°C, 1000 hrs
  • Pressure Cooker, Ta = 121°C/Rh = 100%/P = 2 atm, 96 hrs
  • Temperature Cycle, -65~150°C, 300 cycles

 

Test Service

Amkor offers full turnkey business for all power discrete products. We have the capability to test various type of power devices including MOSFETs, ipolar transistors, IGBTs, diodes, regulator ICs/intelligent power devices, etc.

  • Amkor power discrete test capability:
    • Static test (DC)
    • Dynamic test (AC, Switching/Trr, Capacitance/Rg)
    • Destruction test (Inductive load/VSUS, I Latch, Surge, Isolation/VIL)
    • Thermal Resistance (ΔVDS, ΔmV, etc.)
  • Program generation/conversion
  • Failure analysis
  • Available test/handling technology
  • Integrated marking, vision inspection and tape & reel services

 

Shipping

  • Tape and reel packing
  • 3000 pcs or 5000 pcs per reel
  • Tape width 12 mm
  • Reel Φ = 330 mm
  • Barcode packing label
  • Drop ship

 

 TSON8 Cross Section

 

 TSON8 Outline Drawing

 For more information on the TSON8-FL discrete package, please contact an Amkor Regional Sales Office near you or fill out the Request Form.

Packaging