CHANDLER, Ariz., June 30, 2008 — Amkor Technology, Inc. (Nasdaq: AMKR) today announced the introduction of a new flip chip packaging technology to be featured at SEMICON West2008 July 15 - 17. The breakthrough in high performance flip chip packaging utilizes an advanced molding process technology that is expected to provide a number of design, cost and performance advantages for field programmable gate arrays, CPUs, graphics processors and ASICs that are widely used in embedded processing applications like PCs, servers, switches and personal gaming machines. The new molding process establishes a platform technology, with the first package offering for flip chip (over) molded ball grid array called FCMBGA.
The advanced molding process used in the FCMBGA package underfills the flip chip die with molding compound providing both mechanical and electrical performance advantages. Mechanical advantages include:
Electrical improvements include:
“Amkor developed this technology as a cost and performance enhancement to our industry leading SuperFC® package family. The molded structure improves coplanarity without requiring a stiffener, yet offers flexibility for lid attach in large package or high power applications,” said Miguel Jimarez, vice president of Advanced Process Development at Amkor.
Amkor Technology, Inc. (Nasdaq: AMKR) is a leading provider of semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company's SEC filings. Additional technical information on FCMBGA can be found on Amkor's web site: www.amkor.com.
Contact: Amkor Technology, Inc. Manager II, Marcom Shellene Garner, 480-821-5000 ext. 5415 email@example.com