CHANDLER, Ariz. & SINGAPORE -- Amkor Technology, Inc. (Nasdaq: AMKR) and United Test and Assembly Center Ltd. (SGX: UTAC) today announced that they have entered into a multi-year cross-licensing agreement under which Amkor will license its MicroLeadFrame® patents to UTAC, and UTAC will license its QFN patents to Amkor. The agreement covers the license of intellectual property rights and transfer of associated packaging technologies.

MicroLeadFrame®, or MLF®, is Amkor's proprietary version of an integrated circuit package with the generic nomenclature of QFN, which stands for "quad, flat-pack, no lead." Amkor's MLF package is a leadframe-based, nearly chip-scale package with an exposed die paddle and leads on the bottom of the package, providing excellent thermal and electrical performance. Since its introduction in the late 1990's Amkor has seen broad adoption of its MLF technology, and over the past five years, Amkor has shipped approximately five billion MLF packages.

"Our MicroLeadFrame package has been widely adopted by IC suppliers as a cost-effective alternative for conventional low lead-count packages, and MLF continues to be vital to the success of Amkor's leadframe and CSP product lines," said Oleg Khaykin, Amkor's Executive Vice President and Chief Operating Officer. "We are pleased that UTAC has sought to adopt our technology."

Lee Joon Chung, UTAC's Group President and CEO, noted "These QFN products are a key part of our assembly strategy, and we are pleased to have entered into a cross licensing arrangement on the MLF / QFN products with Amkor."

About Amkor:

Amkor Technology, Inc. is a leading provider of advanced semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com.

About United Test and Assembly Center Ltd (UTAC):

United Test and Assembly Center Ltd ("UTAC", SGX-ST: UTAC) is a leading independent provider of semiconductor assembly and testing services for a broad range of integrated circuits including memory, mixed-signal, logic and radio-frequency ICs. The Group offers a full range of package and test development, engineering and manufacturing services and solutions to a worldwide customer base, comprising leading integrated device manufacturers ("IDMs"), fabless companies and wafer foundries. UTAC operates manufacturing facilities in Singapore, Thailand, Taiwan and China, in addition to its global network of sales offices in the United States, Europe, Japan, Korea, China and Singapore. More information on the company can be found at www.utacgroup.com.
Contact:

Amkor Technology, Inc.
Jeffrey Luth, 480-821-5000, ext. 5130
VP Corporate Communications
jluth@amkor.com
or
UTAC
Josephine Lim, (65) 6551 1511
Manager, Corporate Communications
media@sg.utacgroup.com