CHANDLER, Ariz. - October 16, 2006 - Amkor Technology, Inc. (Nasdaq: AMKR) today announced that it has commenced operations at its new 300mm wafer bump factory in Singapore using the industry-leading wafer bump processes currently offered by Amkor in Taiwan. In conjunction with its existing probe and test facility in Singapore, Amkor now offers Singapore customers a complete suite of wafer bump, probe and final test services to support emerging flip chip applications using Common Platform advanced silicon at the 90nm and 65nm process nodes.
The new bumping facility, located at 2 Science Park Drive, will have an initial capacity of 8,000 wafers per month, with the potential to reach 30,000 wafers per month in the coming years.
"We established this factory in collaboration with Chartered Semiconductor Manufacturing and other Common Platform customers operating in Singapore to support the growing adoption of flip chip packaging for advanced silicon," said Oleg Khaykin, Amkor's executive vice president and chief operating officer. "Our near-term production build-out is largely supported by longterm supply agreements for both bump and probe services. This new factory complements our existing flip chip assembly and test capabilities and our association in the Common Platform ecosystem, and it enhances Amkor's position as the industry's leading provider of turnkey flip chip assembly and test services. We intend for this facility to support our most advanced 300mm bumping technologies."
Amkor is a leading provider of advanced semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and, manufacturing and support services. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com.
Forward Looking Statement Disclaimer
This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 that involve risks and uncertainties, including, without limitation, statements regarding emerging flip chip applications; initial and future capacity in the new bumping facility; growing adoption of flip-chip packaging; long-term supply agreements for both bump and probe services; and support of 300mm bumping technologies. These forwardlooking statements are subject to a number of risks and uncertainties that could affect future results and cause actual results and events to differ materially from historical and expected results, including, but not limited to consumer demand for products incorporating packages based on Common Platform technologies; our relationships with IBM, Chartered, Samsung and others; and our ability to install capacity, and support emerging flip chip applications and advanced 300mm bumping technologies.
Further information on risk factors that could affect the outcome of the events set forth in these statements and that could affect the company's operating results and financial condition is detailed in the company's filings with the Securities and Exchange Commission, including the Report on Form 10-K for the year ended December 31, 2005 and Form 10-Q for the quarter ended June 30, 2006.
VP Corporate Communications
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