CHANDLER, Ariz., Nov. 10 -- Amkor Technology, Inc. (Nasdaq: AMKR) announced today that it has prevailed in its patent infringement suit filed against its Malaysian competitor Carsem in the International Trade Commission. The Administrative Law Judge ("ALJ") has determined that Carsem violated Section 337 of the Tariff Act in the importation and/or sale of the Carsem QFN devices by reason of infringement of the claims of Amkor's MicroLeadFrame® patent.
"Since we initiated this suit in 2003, we have maintained that Carsem has infringed on our MicroLeadFrame® patents, and we are pleased that the ALJ has found a violation of the Tariff Act. We are confident that the Commission will uphold the ALJ's determination and issue an exclusion order which would prohibit Carsem from importing its infringing QFN products into the United States," said John Boruch, Amkor's President and COO.
MicroLeadFrame® is Amkor's proprietary version of an IC package with the generic nomenclature of QFN, which stands for "quad, flat-pack, no lead."
Amkor Technology, Inc. is a leading provider of contract semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com.
Contact: Amkor Technology Jeffrey Luth VP Corporate Communications (480) 821-5000 Ext. 5130 firstname.lastname@example.org