Amkor Asserts Leadership Position in Next Wave of 3D Packaging
CHANDLER, Ariz., July 14 / -- Amkor Technology, Inc. (Nasdaq: AMKR) today outlined how its award-winning Package Stackable Very-Thin Fine-Pitch BGA (PSvfBGA) package is becoming the solution-of-choice for an increasing number of mobile consumer applications that require 3D integration of logic and memory devices through innovative Package-on-Package (PoP) stacking technology.
PoP stacks -- a vertical alignment of very thin BGA packages -- are specifically designed to integrate logic and memory components in separate packages using a standardized architecture. This approach enables OEMs to achieve higher levels of integration, optimize sourcing and product design flexibility, and realize faster time to market.
Amkor's PSvfBGA is a high-density logic-IC package that resides at the bottom of the PoP stack. The package reduces the routing density and component area required in the underlying motherboard, and thus forms an interconnect foundation for the entire PoP stack. The top of Amkor's package has a standard surface mount pad interface between the base logic and top memory components. The standard interface is designed to support a broad range of memory device combinations required for current and next generation products.
"The PSvfBGA package itself is a key enabler for the most feature-rich cell phones coming onto the consumer market," said James Fusaro, Amkor's corporate vice president for assembly. "But the true value of this package is its scalability as a fundamental PoP technology that supports a broad range of potential applications."
Amkor has been developing its PoP technology over the past four years in collaboration with several key players in the microelectronics supply chain, including a leading global handset manufacturer and the industry's top suppliers of digital baseband and memory chips. Amkor's PSvfBGA package recently received Advanced Packaging's Best Product Award and Semiconductor International's Editor's Choice Best Product Award for semiconduct or manufacturing excellence. The package has been in high volume production since late 2004 and is offered in multiple body sizes and configurations.
"The exciting thing about our PoP solution is that it was developed to address the technical, business and logistics challenges that arise when integrating devices from different technologies and suppliers," said Fusaro. "PoP provides the OEM and device suppliers with a standard platform to produce cost-effective, scalable solutions for integrating logic and memory in high end cell phones. In the final analysis, PoP's capabilities and scalability help take time, cost and complexity out of the OEM's product development cycle, thus benefiting the consumer and creating a win-win for everyone involved."
OEMs see PoP technology as the next advancement for the industry beyond traditional die stacking. "While die stacking has its applications, increasingly there are unacceptable yield losses, multiple test insertions, unacceptable die margins, and complicated supply-chain issues that limit available device combinations," said Walt Marcinkiewicz, senior systems engineer in the Chief Technology Office of Sony Ericsson Mobile Communications. "In addition to solving many of these issues, PoP provides greater flexibility to match memory capacity to changing market requirements late in the handset development cycle."
PoP technology is essential in enabling continued high-functional IC integration that is economically practical and sensitive to time-to-market constraints. Amkor expects the use of PoP technology to spread beyond cell phones into digital still cameras and a wide range of multi-media applications.
"We have established expertise in design rules, materials sets, and assembly processes to develop the PSvfBGA platform," said Lee Smith, senior director for laminate business development. "It is significant that in addition to the development work behind this package, Amkor teams with leading logic and memory suppliers to develop JEDEC industry standards and aggressive PoP roadmaps. This has created a supply chain infrastructure that can scale with OEM's functional integration, size and cost reduction requirements."
Amkor Technology, Inc. is a leading provider of contract semiconductor assembly and test services, offering semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. With 2004 revenues of $1.9 billion, Amkor has over 22,000 employees worldwide and operates factories in China, Japan, Korea, the Philippines, Singapore, Taiwan and the U.S. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com.
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