CHANDLER, Ariz., Nov. 22 -- Amkor Technology, Inc. (Nasdaq: AMKR) said today that with respect to its patent infringement suit filed against Carsem in the International Trade Commission, the Administrative Law Judge has issued an initial determination that Carsem infringed some of Amkor's patent claims relating to its MicroLeadFrame® package technology, that some of Amkor's 21 asserted patent claims are valid, and that all of Amkor's asserted patent claims are enforceable. However the judge did not find a statutory violation of the Tariff Act.
Amkor will file a petition to have the judge's ruling reviewed by the full International Trade Commission.
"We are disappointed that the initial determination did not find a statutory violation of the Tariff Act, which would have allowed us to seek an order excluding Carsem from importing their Micro Leadframe Package product into the U.S.," said John Boruch, Amkor's president and chief operating officer. "Nonetheless, Amkor has many patents which protect our investment in MicroLeadFrame® package technology, and we will continue to protect our intellectual property rights related to QFN products, including Carsem's Micro Leadframe Package."
MicroLeadFrame® is Amkor's proprietary version of an IC package with the generic nomenclature of QFN, which stands for "quad, flat-pack, no lead."
Amkor Technology, Inc. is a leading provider of contract semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company's SEC filings and on Amkor's web site: http://www.amkor.com.
Contact: Amkor Technology Jeffrey Luth VP Corporate Communications (480) 821-2408 Ext. 5130 email@example.com