CHANDLER, Ariz., April 19 - Amkor Technology, Inc. today announced that it is providing assembly and test services to THine Electronics, Inc., a rapidly growing fabless semiconductor company based in Tokyo. Initially, Amkor will assemble and test THine's new RF chip for cell phone applications using Amkor's MicroLeadFrame® package, which has been designed to meet Japan's QFN specifications. Amkor will perform the assembly and test at its J1 factory in Iwate, Japan, with volume production starting in the second quarter of 2004.
"Our partnership with Amkor gives us both domestic and regional assembly and test with enough production capacity of more than one million pieces per month, which is crucial to our corporate expansion goals," said Dr. Tetsuya Iizuka, president and CEO of THine Electronics. "Because the first product that Amkor is packaging for us is our introduction into the cell phone RF market, we want to keep assembly and test in a domestic location to ensure that we meet our customer's goals. However longer term, we believe Amkor has the operational capabilities to provide THine with world class assembly and test support from several locations as we expand our presence in Asia."
"Our emerging business relationship with THine is another element contributing to Amkor's position as the leading provider of contract semiconductor assembly and test in Japan," said Jim Fusaro, senior vice president and general manager of Amkor Japan. "We look forward to supporting THine in their efforts to capitalize on growing market opportunities in Japan and throughout Asia."
About THine Electronics
THine Electronics Inc. (JASDAQ: code6768) is a fabless IC manufacturer providing innovative mixed signal LSI and analog technologies, such as LVDS, other high-speed data signaling, timing controller, ADC, RF and power management. These target growing niche markets, including flat panel TVs, LCD monitors, projectors, projection televisions, mobile phones, and automotive markets. THine is headquartered in Tokyo, has design centers in Kyoto and Kyushu, Japan, and a subsidiary Taipei. See more information at www.thine.co.jp.
Amkor Technology, Inc. (Nasdaq: AMKR - News) is a leading provider of contract semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com.
This press release contains forward-looking statements within the meaning of federal securities laws, including, without limitation, statements regarding the timing and achievement of high volume production. These forward-looking statements are subject to a number of risks and uncertainties which could cause actual results and events to differ materially from historical and expected results, including, but not limited to, the highly unpredictable nature of the semiconductor industry; volatility of consumer demand for products incorporating our semiconductor packages; deterioration of the U.S. or Asian economies; competitive pricing and declines in average selling prices of our products. Further information on risk factors that could affect the outcome of the events set forth in these statements and that could affect our operating results and financial condition is detailed in the Amkor's filings with the Securities and Exchange Commission, including the Report on Form 10-K for the year ended December 31, 2003.
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