CHANDLER, Ariz., April 1 -- Amkor Technology, Inc., (Nasdaq: AMKR) today announced that James "Mark" Bird, Technology Fellow and Senior Director of Technical Marketing, has been elected chair of JEDEC's Mechanical (Package Outlines) Standardization Committee, JC-11. This committee covers mechanical standardization of a broad range of semiconductor package formats including PLCC, SOIC, QFP and BGA; advanced package applications such as FBGA, SON, QFN, and wafer scale BGA; and also modules, system-in-package, and stacked die packages. In addition to covering mechanical package outlines, JC-11 also creates design guides for future variations and families as well as the next level package interface media such as test carriers, matrix trays and shipping tubes, test sockets, and contactors.

JC-11 creates collaborative standards with the JEITA EE-13 organization in Japan and then represents the United States creating international standards through the International Electrotechnical Commission.

"JEDEC's confidence in Mark's ability to lead and drive the JC-11 committee is well founded. Amkor is committed to playing a leading role in setting worldwide standards in semiconductor packaging," said Bruce Freyman, Amkor's president and chief operating officer.

About Amkor

Amkor Technology, Inc. (Nasdaq: AMKR - News) is a leading provider of contract semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com.

For more information, please contact Jeffrey Luth of Amkor Technology, Inc., +1-480-821-2408, ext. 5130, jluth@amkor.com; or Martijn Pierik of Positio Public Relations, Inc., +1-408-453-2400, martijn@positiopr.com.