CHANDLER, Ariz. and TOKYO, March 23 -- Amkor Technology, Inc., CASIO COMPUTER CO., LTD. and CASIO MICRONICS CO., LTD. today jointly announced that they have established business and technology licensing agreements for assembly and test of wafer-level semiconductor packages, commonly known as WLP. The agreements link CASIO's expertise in the processing technologies used in wafer-level packaging with Amkor's proficiency in semiconductor assembly and test.
Wafer-level packages are created by building the package interconnects directly on the surface of the wafer. CASIO's WLP technology improves electrical performance with copper routing and post. This structure, along with the screen printing encapsulation process, provides a high level of reliability and can be used with up to 300mm (12 inch) wafers. Wafer level packages are used with logic, memory, and RF devices primarily in consumer electronic products, including cell phone handsets and other wireless applications, digital cameras and other handheld devices.
As part of the collaboration, Amkor will undertake sales and marketing of this WLP product. CASIO MICRONICS will provide wafer level processing and Amkor will conduct final test, singulation and inspection of the WLP devices. Amkor also has the option to enter into a technology license with CASIO under which Amkor would have the ability to install and use CASIO's WLP technology in Amkor's factories.
"This collaboration builds on our existing wafer-level packaging capability with the addition of CASIO's outstanding WLP technology," said Bruce Freyman, Amkor's president and chief operating officer. "We have already identified several business opportunities with Japanese semiconductor companies. While we do not expect this joint effort to result in significant revenue during 2004, we do anticipate growing adoption of wafer-level packaging in Japan and elsewhere. We have the added flexibility of installing CASIO's WLP technology in our factories as customer demand reaches a critical mass."
"CASIO and CASIO MICRONICS look forward to partnering with Amkor's production capability, packaging experience, and worldwide sales force. This agreement represents an important step in accelerating the standardization of WLP packaging and expanding its adoption by semiconductor suppliers and electric device manufacturers," said Yukio Kashio, CASIO's executive vice president.
Amkor Technology, Inc. (Nasdaq: AMKR - News) is a leading provider of contract semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company's SEC filings and at www.amkor.com.
About CASIO COMPUTER CO., LTD.
CASIO COMPUTER CO., LTD. is one of the leading consumer electronics companies in the world. Since its establishment in 1957, it has been active in the development of a range of consumer electronic products such as electronic calculators, timepieces, musical instruments, digital cameras and mobile phones. In recent years, CASIO has also focused on technologies for compact LCDs, LSI chip mounting processes and other electronic devices. More information on CASIO is available at: http://world.casio.com/
About CASIO MICRONICS CO., LTD.
CASIO MICRONICS CO., LTD provides high-density packaging to the IT industry as the core of compact, light, and thin mobile information terminals, such as cellular phones, notebook PCs and PDAs, and other electronic gears. The primary services are wafer bumping, tape carrier package (TCP) film and assembly. More information on CASIO MICRONICS is available on CASIO MICRONICS's web site: www.casio-micronics.co.jp/en/
For further information, please contact: Jeffrey Luth of Amkor
Technology, Inc., +1-480-821-2408 ext. 5130, email@example.com; or media,
Martijn Pierik of Positio Public Relations, Inc., +1-408-453-2400,
firstname.lastname@example.org, for Amkor; or media, Benjamin Gurnsey of Cosmo Public
Relations, 81-3-5561-2915, email@example.com, for CASIO.