CHANDLER, Ariz., Dec. 18 -- Amkor Technology (Nasdaq: AMKR) today said that U.S. International Trade Commission has voted to pursue an investigation of a complaint brought by Amkor on November 18, 2003 against Carsem (M) Sdn Bhd, Carsem Semiconductor Sdn Bhd, and Carsem Inc. (collectively "Carsem"). The complaint alleges infringement of three Amkor patents relating to its MicroLeadFrame® packaging technology.

We are pleased that the ITC has decided to investigate our claim of patent infringement, and we look forward to their final determination," said John Boruch, Amkor's president and chief operating officer.

Amkor Technology, Inc. is a leading provider of contract semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design, packaging and test services. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com .

For further information, please contact: Paul W. Davis, Director, Intellectual Property, ext. 5755, pdavi@amkor.com , or Jeffrey Luth, VP, Investor Relations, ext. 5130, jluth@amkor.com , both of Amkor Technology, Inc., +1-480-821-5000.