CHANDLER, Ariz., Nov 19 -- Amkor Technology, Inc. (Nasdaq: AMKR) has filed suit in Federal District Court in the Northern District of California, against Carsem(M) Sdn Bhd, Carsem Semiconductor Sdn Bhd, and Carsem Inc. (collectively "Carsem"). The suit alleges infringement of Amkor's United States Patent Nos. 6,433,277, 6,455,356, and 6,630,728 (collectively the "Amkor Patents"). Amkor alleges that by making, using, selling, offering for sale, or importing into the U.S. of the Carsem Dual and Quad Flat No-Lead Package, the defendants infringe on one or more of the MicroLeadFrame® packaging technology claims in the Amkor Patents. The District Court suit seeks both injunctive relief and monetary damages and is a counterpart legal action to a previously filed lawsuit against Carsem in the International Trade Commission, which seeks to halt importation of infringing products.
Amkor Technology, Inc. is a leading provider of contract semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronics design and manufacturing services. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com .
Forward-Looking Statement: This news release may contain forward-looking statements that involve risk and uncertainty that could cause actual results to differ from anticipated results. Further information on risk factors that could affect the outcome of events set forth in these statements and that would affect the company's operating results and financial condition is detailed in the company's filings with the Securities and Exchange Commission, including the Report on Form 10-K for the fiscal year ended December 31, 2002.
For more information, contact: Paul W. Davis, Director, Intellectual Property, ext. 5755, or Jeffrey Luth, VP, Corporate Communications, ext. 5130, email@example.com , both of Amkor Technology, Inc., +1-480-821-5000.