Enables Japanese IC Companies to Increase Assembly and Test Outsourcing

CHANDLER, Ariz., Oct. 29 --Amkor Technology, Inc., (Nasdaq: AMKR) reported today that it has completed qualification for two IC packaging solutions in its J1 factory in Kitakami, Iwate-Prefecture, Japan -- the Stacked Chip Scale Package (S-CSP) and the Very Thin ChipArray® Ball Grid Array (CVBGA).

These packages are widely used in cell phones and other wireless systems, PDAs, camcorders, and a broad range of high-end consumer electronics where applications increasingly demand thin, high-density packaging of semiconductor devices.

"This is an important addition to our capability in Japan," said Naohiko Urasaki, president of Amkor Japan. "Japan is the world's market leader in advanced cell phone and personal digital device manufacturing. Both the S-CSP and the CVBGA solve packaging needs for these continually evolving consumer products."

S-CSP

Amkor's S-CSP combines thin-core substrates, silicon wafer thinning, and film die attach. The initial S-CSP qualification at Amkor's Japan factory is for "pyramid structures" where the top die is smaller than the bottom die. Amkor will be introducing more advanced die stacking technology in Japan to support the local market. By early 2004 Amkor's Japan factory is expected to support back grinding wafers to 3 mils. This will enable implementation of even thinner die and packages, including same-size-die S-CSP and stacking three or more die in one package.

S-CSPs continue to derive increasing demand from cell phone handsets that combine voice and data functions. Today's 2G phones with two die stacks of Flash and SRAM support voice send and receive; 2.5G handsets require three die stacks to support the addition of memory storage required for voice plus basic data services, such as accessing e-mail, the Internet, and transmitting digital photographs.

With the addition of multimedia services, today's emerging 3G handsets will require even more memory to process higher bandwidth-ratio signals and computing functions on received data, including audio and video playback. Some industry watchers foresee 3G phones requiring four die S-CSPs. Data from market research firm Prismark shows that in 2004 ~85% of the phones produced will be using stacked CSP, up from ~50% in 2002 and 70% in 2003.

CVBGA

CVBGA is an Amkor CSP with a thin-core two-metal-layer rigid laminate substrate and a thin molded cap. Total package height is <1.0 mm. Ball lead counts range from 36 to 500. This design allows dense routing for multi-chip packages.

Increasingly, CVBGA packages are being chosen for a broad range of applications in feature-loaded consumer devices where the internal need is for chip integration in a small footprint, low height package. This IC packaging technology is applicable for memory, analog, ASICs, RF devices, and other chips. Applications include cell phones and pagers, notebook and sub-notebook PCs, PDAs and other wireless systems.

According to analysts at Semico Research Corp., BGAs are the predominate packaging solutions for what it sees as the four rapidly growing consumer semiconductor end use markets -- digital cameras, digital cordless phones, digital TVs and DVD players. Each of these markets is experiencing a tremendous push toward integration. All four have a CAGR of more than 20% for units shipped for the period from 2002 through 2007.

Amkor in Japan

These recent package qualifications at Amkor's Japan continue the company's successful expansion into the local market, which has historically seen very little outsourcing of IC packaging and test.

"Miniaturization, quality and performance, done cost effectively, define Japan's microelectronics products," said Jim Fusaro, Amkor's senior vice president for Japan sales. "Expanding and leveraging our Japan factory with proven CSP technologies provides the local Japan market with greater flexibility in addressing its growing assembly and test outsourcing needs. We are focusing on high-end products in Japan with 100% test support."

About Amkor:

Amkor Technology, Inc. is the world's largest provider of contract semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com .

ChipArray® is a registered trademark of Amkor Technology, Inc.

For further information, please contact: Jeffrey Luth of Amkor Technology, Inc., +1-480-821-2408, ext. 5130, jluth@amkor.com; or Martijn Pierik of Positio Public Relations, Inc., +1-650-815-1006, martijn@positiopr.com, for Amkor Technology, Inc.