SAN JOSE, Calif., July 16 -- Amkor Technology, Inc. (Nasdaq: AMKR) announced that Bruce Freyman, Executive Vice President, Operations, has received the Electronics Manufacturing Technology Award for 2003 from the IEEE Components Packaging and Manufacturing Technology Society. The award was presented today at the International Electronics Manufacturing Technology Symposium in conjunction with Semicon West, the industry's largest trade gathering.
"The CPMT Society is recognizing Bruce's pioneering work in developing the plastic ball grid array (PBGA) package and for his vision and drive in making the PBGA package and its format commercially successful," said Motorola's Rao Bonda, chair of the awards committee.
"Few events have impacted technological and economic evolution in the semiconductor packaging industry as much as the introduction and commercialization of the PBGA package," said Bonda. "The work done by Bruce and the Motorola team on PBGAs changed the course of the semiconductor industry by creating a new packaging technology roadmap based on laminate array packaging."
Amkor Technology, Inc. is the world's largest provider of contract semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com.
For further information, please contact: Jeffrey Luth, VP Corporate Communications of Amkor Technology, Inc., +1-480-821-2408 ext. 5130, email@example.com.