CHANDLER, Ariz., July 3 -- Semiconductor packaging leader Amkor Technology (Nasdaq: AMKR) today detailed efforts and achievements of developing and qualifying wire bond and flip chip packaging for devices manufactured on TSMC's advanced low-k process technologies. Amkor has also worked with several customers on low-k product qualification, and expects volume ramp-up for low-k packages in the second half of the year.
According to Richard Groover, vice president of Amkor's flip chip product business unit, "TSMC's leading-edge technology development efforts, from early design through final packaging, reflect its position as an industry leader and innovator, and this has become particularly apparent at sub 130 nm manufacturing. As the market leader and pioneer in advanced semiconductor packaging technology, Amkor is pleased with the progress of our cooperative developments with TSMC on packaging technology efforts. We are committed to supporting TSMC's drive to fully commercialize its next-generation semiconductor technology."
The cooperation between the two companies started in mid-2002 with the goal of providing reliable and cost-effective high-end wire bond and flip chip packaging for devices manufactured on 0.13-micron, low-k processes. Low-k dielectric, coupled with Cu interconnects, significantly improves the performance of silicon devices, and is expected to be increasingly adopted by customers. Amkor successfully qualified wire bond and flip chip packaging for TSMC's 0.13-micron, low-k technology early this year. Currently, Amkor's primary research focus is on qualification and production preparation of 90 nm packages. TSMC has reported more than twenty 90 nm customer projects, which are at various levels of the design stage.
"Working with Amkor in low-k packaging provides us with additional engineering capabilities and capacity to reduce costs and risk, while facilitating the introduction of leading-edge manufacturing processes," commented N.S. Tsai, senior director of TSMC responsible for assembly and test. "Through the cooperation between Amkor and TSMC, customers will have a reliable and cost effective product when they need it."
"In the sub 130 nm era, the packaging challenges associated with low-k silicon increase dramatically, and having the right technology is critical to achieving optimal device performance," noted Groover. "Amkor is developing a core competency in sub 130 nm packaging technology, and our cooperation with TSMC is a win-win for all of our respective customers."
Amkor Technology, Inc. is the world's largest provider of contract semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com .
For further information, please contact: Jeffrey Luth of Amkor Technology, Inc., +1-480-821-2408, ext. 5130, email@example.com; or Martijn Pierik of Positio PR, +1-602-485-0962, firstname.lastname@example.org, for Amkor Technology, Inc.