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2004 Press Releases
04/20/2004
Amkor to Assemble and Test Semiconductors for Japan's THine Electronics
04/01/2004
Amkor's Mark Bird Named Chair of JEDEC Mechanical Standardization Committee
03/31/2004
Amkor Technology Announces First Quarter Earnings Conference Call
03/23/2004
Amkor and CASIO Join Forces on Wafer-level Packaging
03/12/2004
Amkor Technology Closes Offering of 7 1/8% Senior Notes Due 2011
03/10/2004
Amkor Technology Announces Pricing of 7 1/8% Senior Notes Due 2011
03/08/2004
Amkor Technology to Issue $250 Million in Notes
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