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2003 Press Releases

07/16/2003
Amkor's Bruce Freyman Receives Electronics Manufacturing Technology Award

07/10/2003
Amkor Ships Billionth MicroLeadFrame Chip Package

07/03/2003
Amkor to Offer Wire Bond and Flip Chip Packaging for TSMC's Advanced Low-k Processes

07/03/2003
Amkor Unveils Industry's Most Comprehensive Packaging Technology Roadmap

07/03/2003
Amkor Reports Growth in Flip Chip Packaging: Chipset, Graphics and DSPs are Key Market Drivers

06/24/2003
Amkor Technology Announces Second Quarter Earnings Conference Call

05/28/2003
Amkor Technology Comments on Japan Earthquake

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