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2010 Press Releases

07/07/2010
Amkor Technology and Texas Instruments Deliver Industry's First Fine Pitch Copper Pillar Flip Chip Packages to Market

06/22/2010
Amkor Technology, Inc. Announces Final Results of Tender Offer for a Portion of Its 9.25% Senior Notes Due 2016

06/07/2010
Amkor Technology, Inc. Announces Early Participation Results of Tender Offer for a Portion of Its 9.25% Senior Notes Due 2016

05/24/2010
Amkor Technology, Inc. Announces Tender Offer for its 9.25% Senior Notes due 2016

05/21/2010
Amkor Named Best-In-Class Partner by LSI

05/18/2010
Amkor Receives Supplier Excellence Award from Altera for Development of Copper Wire Bonding Solutions

05/04/2010
Amkor Technology, Inc. Completes Sale of $345 Million 7.375% Senior Notes due 2018

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