Amkor Technology is the world's leader in MEMS packaging technologies and the world’s largest outsource provider of MEMS and Sensors. Amkor offers a variety of modeling and characterization expertise to complement a proven high volume manufacturing (HVM) capability. This combination uniquely positions Amkor to assist customers quickly through the development phase and into HVM with new applications. Amkor currently has MEMS & Sensor manufacturing in our Korea, Taiwan and Philippines factories.
By assembling, testing and shipping more than one million SiP devices per day, Amkor Technology has a proven track record as the industry leader in SiP design, assembly and test. Similar to a System on Chip (SoC) approach, Amkor's SiP technology is an ideal solution in markets that demand smaller size with increased functionality. However, SiP has the added benefit of compatibility with die design changes and integration of various die technologies (e.g., Si, GaAs, SiGe, SOI, MEMS) without the high cost and lead time associated with SoC development and manufacturing.
Stay Up to Date on Amkor Technology via Email and Social Media
Amkor Technology now offers multiple ways to stay updated about our products, services and technology offerings as well as upcoming industry conferences that we may be presenting and/or exhibiting at.
|06/28/16||Amkor Technology Opens MEMS Packaging Line in China|
|06/21/16||Amkor Technology Receives Qualcomm Technologies’ 2015 Supplier of the Year Award|
|06/03/16||Amkor Technology to Present at Citi’s 2016 Small & Mid Cap Conference|
|05/11/16||Amkor Technology to Present at Goldman Sachs First Annual Leveraged Finance Conference|
|07/12/16||SEMICON West 2016|
|07/13/16||9th Int'l Workshop on Device Test Ecosystem: TestVision 2020|
|09/13/16||ESTC 2016 Conference|
|09/15/16||European MEMS Summit 2016|
|10/10/16||IMAPS 2016 - Pasadena|
|Amkor Article in CSR May/June Issue, "What is Driving Advanced Packaging Platforms Development?" Technical Article
|Amkor Article in CSR March/April Issue, "The Internet of Things and MEMS Packaging" Technical Article